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ACST6-7SR

STMicroelectronics

ACST6-7SR by STMicroelectronics

ACST6-7SR by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max RMS on-state current of 1.5 A, repetitive peak off-state voltage of 700 V, and operates b/w -30 °C to 125°C. Ideal for lighting and motor control applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,253 parts In-Stock

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6,253

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Anansix

USA . 2,794 parts In-Stock

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2,794

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Digiode

USA . 2,467 parts In-Stock

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2,467

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Distributors (Availability)

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Corohmni

South Africa . 251 parts In-Stock

1+ parts

$2.171

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-

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251

$2.171

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IDEA Electronic Components Group

UK . 1,888 parts In-Stock

1+ parts

$2.363

100+ parts

-

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$2.127

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-

1,888

$2.363

-

$2.127

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MKK Technologies

India . 359 parts In-Stock

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$4.444

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-

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359

$4.444

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DigiPath Technology Company

USA . 359 parts In-Stock

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$4.444

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359

$4.444

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$4.823

100+ parts

$4.389

1k+ parts

$3.955

10k+ parts

-

5,000

$4.823

$4.389

$3.955

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AZTECH Wire

Italy . 267 parts In-Stock

1+ parts

$18.910

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267

$18.910

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Kepictronics

USA . 64,000 parts In-Stock

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64,000

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A-Z Elektronik GmbH

Germany . 7,211 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,807 parts In-Stock

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4,807

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Northwest PG Solutions

USA . 2,311 parts In-Stock

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Corphita

USA . 1,215 parts In-Stock

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Parana Technologies

USA . 867 parts In-Stock

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$2.826

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867

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$2.826

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Perfect Parts

USA . 134 parts In-Stock

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134

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Native Components

USA . 53 parts In-Stock

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53

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Overview

Unlock the power of innovation with the ACST6-7SR from STMicroelectronics, a leading name in semiconductor solutions. This robust TRIAC offers unmatched reliability and efficiency, making it ideal for diverse applications like motor control and lighting systems. With its snubberless design and superior thermal performance, you can trust this component to enhance your projects while reducing energy consumption. Experience quality and performance that elevate your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability, offering protection against environmental factors.

Maximum DC Gate Trigger Current: 10 mA

A low maximum DC gate trigger current enables efficient operation and reduces power consumption, making it suitable for energy-sensitive applications.

Configuration: SINGLE

The single configuration simplifies circuit designs and allows for easier integration into electronic systems.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization in electronic designs, facilitating compact layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support and easier soldering in various applications.

Maximum Leakage Current: 0.5 mA

A low maximum leakage current minimizes power loss, enhancing energy efficiency during operation.

No. of Terminals: 3

The inclusion of three terminals allows for versatile connections and functionalities within the circuit.

Package Style (Meter): IN-LINE

The in-line package style is ideal for integration into linear circuits, promoting streamlined assembly processes.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature enables this TRIAC to function effectively in harsher environments, ensuring reliability in diverse applications.

Trigger Device Type: SNUBBERLESS TRIAC

As a snubberless TRIAC, this product reduces the need for external components, simplifying circuit design while improving performance.

Minimum Operating Temperature: -30 °C

With a low minimum operating temperature, this TRIAC can be utilized in a wide range of environments, including extreme cold applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and enhances resistance to corrosion, ensuring a long-lasting connection.

Terminal Position: SINGLE

Having a single terminal position simplifies board design and reduces the risk of assembly errors.

Maximum RMS On-state Current: 1.5 A

A maximum RMS on-state current of 1.5 A makes this TRIAC suitable for controlling loads in various applications, including home appliances.

Maximum DC Gate Trigger Voltage: 1.5 V

The low maximum DC gate trigger voltage enhances safety and reduces the likelihood of damage to controlling circuits.

Case Connection: MAIN TERMINAL 2

Main terminal 2 case connection facilitates effective load switching, ensuring consistent performance in power control applications.

Repetitive Peak Off-state Voltage: 700 V

The high repetitive peak off-state voltage allows this TRIAC to safely handle significant voltage levels, making it ideal for various high-voltage applications.

Minimum Critical Rate of Rise of Off-state Voltage: 200 V/µs

A high minimum critical rate of rise of off-state voltage ensures rapid switching capabilities, which is essential for fast control applications.

Maximum Holding Current: 25 mA

A maximum holding current of 25 mA allows for efficient operation under minimal standby conditions, enhancing overall system efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peak reflow time of 30 seconds is compatible with standard soldering processes, ensuring reliable assembly.

Peak Reflow Temperature (°C): 245

The peak reflow temperature of 245 °C is suitable for a wide range of soldering scenarios, facilitating easy integration into electronic devices.

Technical Specifications

Triode For Alternating Current (TRIAC) ACST6-7SR attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

25 mA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.5 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum RMS On-state Current:

1.5 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

ACST6-7SR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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