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ACS302-5T3

STMicroelectronics

ACS302-5T3 by STMicroelectronics

ACS302-5T3 by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max RMS on-state current of 0.4 A, a repetitive peak off-state voltage of 500 V, and comes in a compact SO package with 20 terminals. Ideal for motor control and lighting applications, it ensures reliable performance in various electronic circuits.

Median Price

$1.089

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 598 parts In-Stock

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$0.858

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-

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598

$0.858

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Chip1Stop

Japan . 600 parts In-Stock

1+ parts

$1.320

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-

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600

$1.320

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Verical

USA . 598 parts In-Stock

1+ parts

-

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598

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Distributors (In-Stock)

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Digiode

USA . 1,020 parts In-Stock

1+ parts

$0.806

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-

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1,020

$0.806

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Vyrian

USA . 8,606 parts In-Stock

1+ parts

-

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8,606

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Anansix

USA . 2,702 parts In-Stock

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2,702

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

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Corphita

USA . 4,091 parts In-Stock

1+ parts

$0.763

100+ parts

-

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4,091

$0.763

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-

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Andel Nordic

Denmark . 630 parts In-Stock

1+ parts

$1.289

100+ parts

-

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$1.238

10k+ parts

$1.238

630

$1.289

-

$1.238

$1.238

IDEA Electronic Components Group

UK . 996 parts In-Stock

1+ parts

$2.799

100+ parts

-

1k+ parts

$2.519

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-

996

$2.799

-

$2.519

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MKK Technologies

India . 709 parts In-Stock

1+ parts

$5.263

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709

$5.263

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DigiPath Technology Company

USA . 709 parts In-Stock

1+ parts

$5.263

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709

$5.263

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Microchip USA

USA . 231 parts In-Stock

1+ parts

$8.190

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231

$8.190

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AZTECH Wire

Italy . 724 parts In-Stock

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$12.610

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724

$12.610

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Native Components

USA . 439 parts In-Stock

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$118.200

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$113.472

439

$118.200

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$113.472

Northwest PG Solutions

USA . 58 parts In-Stock

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$130.020

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58

$130.020

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Parana Technologies

USA . 1,379 parts In-Stock

1+ parts

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$3.346

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1,379

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$3.346

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Perfect Parts

USA . 1,159 parts In-Stock

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1,159

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Overview

Elevate your designs with the ACS302-5T3 from STMicroelectronics, a premium triode for alternating current that combines reliability and performance. Renowned for its innovative engineering, STMicroelectronics ensures this component delivers superior quality with high voltage capabilities, making it ideal for a wide range of applications like motor control and lighting systems. Experience enhanced efficiency and durability, guaranteeing long-lasting solutions for your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers excellent durability and protection against environmental factors, making it suitable for various applications.

Configuration: COMMON MAIN TERMINAL 1, 3 ELEMENTS

This configuration simplifies integration within circuits, allowing for easier design and implementation in electronic systems.

Surface Mount: YES

The surface mount capability provides a more compact design and facilitates higher assembly speeds, which is ideal for modern electronics.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient space utilization on PCBs, contributing to reduced overall device size.

Terminal Form: GULL WING

Gull wing terminals are designed for easy soldering, enhancing mechanical strength and ensuring reliable connections in electronic applications.

No. of Elements: 3

Having three elements supports more complex circuit designs while maintaining robust performance, making it a versatile choice.

No. of Terminals: 20

With 20 terminals, this TRIAC offers ample connectivity options for complex circuitry, enhancing functionality and versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact applications, enabling space-saving designs without compromising performance.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless trigger device type increases reliability in switching applications, reducing the need for additional components.

Terminal Finish: NICKEL PALLADIUM GOLD

This premium terminal finish enhances conductivity and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: DUAL

Dual terminal positioning improves flexibility in circuit layout and design, accommodating various PCB configurations.

Maximum RMS On-state Current: 0.4 A

A maximum RMS on-state current of 0.4 A provides sufficient current handling for a variety of applications, ensuring reliable operation.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, necessitating some handling precautions, yet allowing for good reliability in less demanding environments.

Repetitive Peak Off-state Voltage: 500 V

The high repetitive peak off-state voltage of 500 V makes this TRIAC suitable for controlling high voltage AC loads safely and effectively.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds allows for compatibility with efficient soldering processes in manufacturing, supporting high-volume production.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of 260 °C ensures that the component can tolerate high thermal processing during manufacturing.

Technical Specifications

Triode For Alternating Current (TRIAC) ACS302-5T3 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY, WITH BUILT IN CLAMPING STRUCTURE AND GATE LEVEL SHIFTER DRIVER

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Elements:

3

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

.4 A

Repetitive Peak Off-state Voltage:

500 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

ACS302-5T3 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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