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ACS302-5T3-TR

STMicroelectronics

ACS302-5T3-TR by STMicroelectronics

ACS302-5T3-TR by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max RMS on-state current of 0.4 A, operates b/w -30 °C to 125°C, and supports up to 500 V peak voltage. Ideal for compact surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,021 parts In-Stock

1+ parts

-

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3,021

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Anansix

USA . 2,521 parts In-Stock

1+ parts

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2,521

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Digiode

USA . 1,903 parts In-Stock

1+ parts

-

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1,903

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 551 parts In-Stock

1+ parts

$0.236

100+ parts

-

1k+ parts

-

10k+ parts

$0.227

551

$0.236

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-

$0.227

Northwest PG Solutions

USA . 622 parts In-Stock

1+ parts

$0.260

100+ parts

-

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-

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$0.229

622

$0.260

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-

$0.229

IDEA Electronic Components Group

UK . 2,372 parts In-Stock

1+ parts

$3.617

100+ parts

-

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$3.255

10k+ parts

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2,372

$3.617

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$3.255

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MKK Technologies

India . 1,613 parts In-Stock

1+ parts

$6.801

100+ parts

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1,613

$6.801

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DigiPath Technology Company

USA . 1,613 parts In-Stock

1+ parts

$6.801

100+ parts

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1,613

$6.801

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-

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AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$13.800

100+ parts

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192

$13.800

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Corphita

USA . 3,067 parts In-Stock

1+ parts

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3,067

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Parana Technologies

USA . 1,718 parts In-Stock

1+ parts

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100+ parts

$4.324

1k+ parts

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1,718

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$4.324

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Overview

Elevate your projects with the ACS302-5T3-TR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This advanced TRIAC offers superior performance and reliability for controlling AC loads, making it an ideal choice for lighting, motors, and heating applications. With its snubberless design, you'll enjoy enhanced efficiency and reduced complexity. Choose STMicroelectronics for unparalleled quality and unlock the full potential of your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for a wide range of applications.

Configuration: COMMON MAIN TERMINAL 1, 3 ELEMENTS

This configuration allows for easier integration into circuits, providing flexibility in design and implementation.

Surface Mount: YES

Surface mount compatibility enhances manufacturing efficiency by allowing for automated assembly and saving space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the circuit board, contributing to compact designs and effective thermal management.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and ensure good mechanical strength, which is beneficial for long-term reliability.

No. of Elements: 3

Having three elements enhances the device's functionality, allowing it to handle various electrical demands more effectively.

No. of Terminals: 20

With 20 terminals, this TRIAC can connect to multiple circuit paths, offering versatility in application.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for high-density applications where space is a constraint, making it a practical choice for modern electronics.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C allows for reliable performance in demanding environments, reducing the risk of thermal failure.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design minimizes power loss and enables better efficiency, making it suitable for energy-sensitive applications.

Minimum Operating Temperature: -30 °C

With a minimum operating temperature of -30 °C, this TRIAC is well-suited for cold climate applications, ensuring consistent performance in extreme conditions.

Terminal Position: DUAL

The dual terminal position enhances connection options, making installation more straightforward and adaptable to various layouts.

Maximum RMS On-state Current: 0.4 A

A maximum RMS on-state current of 0.4A indicates this TRIAC can manage moderate loads, providing a balance of performance and efficiency for typical applications.

Repetitive Peak Off-state Voltage: 500 V

Withstanding repetitive peak off-state voltage of 500V makes this TRIAC robust enough to handle high-voltage applications, ensuring safety and reliability.

Technical Specifications

Triode For Alternating Current (TRIAC) ACS302-5T3-TR attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY, WITH BUILT IN CLAMPING STRUCTURE AND GATE LEVEL SHIFTER DRIVER

JESD-30 Code:

R-PDSO-G20

No. of Elements:

3

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

.4 A

Repetitive Peak Off-state Voltage:

500 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

ACS302-5T3-TR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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