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74VHCT32ATTR

STMicroelectronics

74VHCT32ATTR by STMicroelectronics

74VHCT32ATTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 9 ns, operating at a nominal voltage of 5V. It features 4 functions and supports surface mount applications in compact designs. Ideal for military-grade electronics, it operates b/w -55 °C to 125°C.

Median Price

$0.290

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 309 parts In-Stock

1+ parts

$0.290

100+ parts

$0.151

1k+ parts

$0.139

10k+ parts

$0.114

309

$0.290

$0.151

$0.139

$0.114

Distributors (In-Stock)

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Digiode

USA . 4,367 parts In-Stock

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$0.390

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$0.390

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Vyrian

USA . 5,061 parts In-Stock

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5,061

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Anansix

USA . 2,887 parts In-Stock

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Electronic Expediters

USA . 2,500 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,793 parts In-Stock

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1,793

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Bristol Electronics

USA . 1,793 parts In-Stock

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-

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$0.322

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$0.129

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1,793

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$0.322

$0.129

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Dan-Mar Components

USA . 1,793 parts In-Stock

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Prism Electronics

USA . 125 parts In-Stock

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Microchip USA

USA . 453 parts In-Stock

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$0.353

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453

$0.353

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Corphita

USA . 1,542 parts In-Stock

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$0.369

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1,542

$0.369

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IDEA Electronic Components Group

UK . 518 parts In-Stock

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$13.587

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$12.229

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518

$13.587

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$12.229

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Native Components

USA . 680 parts In-Stock

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$18.777

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680

$18.777

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Northwest PG Solutions

USA . 1,542 parts In-Stock

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$20.655

100+ parts

$18.589

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1,542

$20.655

$18.589

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MKK Technologies

India . 1,768 parts In-Stock

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$25.550

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$25.550

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DigiPath Technology Company

USA . 1,768 parts In-Stock

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$25.550

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Perfect Parts

USA . 21,172 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,797 parts In-Stock

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Parana Technologies

USA . 1,033 parts In-Stock

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$16.246

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$16.246

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Authorized Procurement Solutions

USA . 365 parts In-Stock

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365

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EMSNET (Excess)

USA . 100 parts In-Stock

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Overview

Elevate your designs with the 74VHCT32ATTR from STMicroelectronics, a premier choice in logic gates that ensures unmatched performance and reliability. With its ultra-low propagation delay and robust temperature range, this component excels in diverse applications—from consumer electronics to industrial automation. Trust in STMicroelectronics’ legacy of quality and innovation, delivering exceptional value that propels your projects to success with ease and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliability and protection against environmental factors.

Propagation Delay At Nominal Supply: 9 ns

A fast propagation delay enables quicker signal transitions, making the device suitable for high-speed applications.

Surface Mount: YES

Surface mount compatibility allows for more efficient use of PCB space and facilitates automated assembly.

No. of Functions: 4

With multiple functions available, this logic gate offers versatility for various applications without needing additional components.

No. of Inputs: 2

Having 2 inputs makes it suitable for basic logic operations, simplifying circuit design.

Package Shape: RECTANGULAR

The rectangular shape is optimized for layout efficiency, allowing for compact and organized circuit designs.

Nominal Supply Voltage / Vsup: 5 V

A standard nominal supply voltage of 5V makes it compatible with a wide range of devices and systems.

Load Capacitance (CL): 50 pF

Low load capacitance reduces the time delay and allows for fast switching, enhancing performance in dynamic applications.

Power Supplies (V): 5

Supports a standard power supply requirement, ensuring easy integration into existing systems.

No. of Terminals: 14

With 14 terminals, it provides ample connectivity options while remaining compact.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The slim profile and shrink pitch design optimize space on PCBs, making it ideal for modern electronics.

Maximum I (ol): 8 Amp

A high output current capacity allows for driving larger loads, expanding the application potential of this logic gate.

Propagation Delay (tpd): 9 ns

Consistent propagation delay ensures reliable performance in timing-critical applications.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes it suitable for demanding environments, ensuring long-term reliability.

Minimum Operating Temperature: -55 °C

Wide temperature range enhances its usability in extreme conditions, making it suitable for various industries including military.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish promotes excellent connectivity and resistance to corrosion, ensuring longer operational life.

Terminal Position: DUAL

Dual terminal positioning aids in flexible PCB layout options, allowing for more efficient designs.

Maximum Seated Height: 1.2 mm

A low seated height supports high-density PCB designs, enabling more compact device layouts.

Width: 4.4 mm

A narrow width aids in compact design solutions, perfect for space-constrained applications.

Minimum Supply Voltage (Vsup): 4.5 V

This minimum supply voltage flexibility allows for lower power consumption scenarios, enhancing energy efficiency.

Length: 5 mm

Short length contributes to space-saving designs and allows for efficient board layouts.

Temperature Grade: MILITARY

A military-grade specification guarantees reliability under harsh conditions, making it suitable for defense and aerospace applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it excellent for portable and battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy mounting and soldering, ensuring solid connections on the PCB.

Packing Method: TR

Transport reel (TR) packing method allows for efficient handling and automatic assembly, optimizing production processes.

Terminal Pitch: 0.65 mm

The small terminal pitch supports higher density designs, allowing for more components in smaller areas.

Maximum Supply Voltage (Vsup): 5.5 V

A higher maximum supply voltage ensures flexibility in operation under various load conditions.

Technical Specifications

Logic Gates 74VHCT32ATTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHCT32ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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