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74VHC238TTR

STMicroelectronics

74VHC238TTR by STMicroelectronics

74VHC238TTR from STMicroelectronics is a CMOS decoder with a fast propagation delay of 11.5 ns, operating b/w 2-5.5 V. It features a compact SOIC package and supports up to 8 A output current, ideal for high-speed digital applications. Its robust design ensures reliability in military-grade environments.

Median Price

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Lifecycle Status

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6

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1k+

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Prism Electronics

USA . 13,598 parts In-Stock

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Vyrian

USA . 2,612 parts In-Stock

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Digiode

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Anansix

USA . 1,223 parts In-Stock

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Bristol Electronics

USA . 670 parts In-Stock

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Atlantic Semiconductor

USA . 670 parts In-Stock

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Native Components

USA . 703 parts In-Stock

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$5.095

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703

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IDEA Electronic Components Group

UK . 2,061 parts In-Stock

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$15.220

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$13.698

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AZTECH Wire

Italy . 1,218 parts In-Stock

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$17.530

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Microchip USA

USA . 384 parts In-Stock

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$24.475

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MKK Technologies

India . 819 parts In-Stock

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$28.621

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DigiPath Technology Company

USA . 819 parts In-Stock

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$28.621

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Perfect Parts

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Assy Fe

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Authorized Procurement Solutions

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Corphita

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Kepictronics

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Northwest PG Solutions

USA . 1,943 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,289 parts In-Stock

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Parana Technologies

USA . 525 parts In-Stock

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GreenTree Electronics

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Overview

Unlock exceptional performance with the 74VHC238TTR from STMicroelectronics, a leader in innovative electronic solutions. This high-speed decoder enhances your applications with its remarkable reliability and efficiency, all wrapped in a compact, surface-mount package. Designed for versatility, it effortlessly supports a wide range of voltage requirements, making it ideal for consumer electronics, automotive systems, and industrial automation. Experience unparalleled quality and precision that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight, durable package suitable for various applications, providing mechanical stability and protection.

Propagation Delay At Nominal Supply: 11.5 ns

A low propagation delay offers fast switching capabilities, making it ideal for high-speed digital circuits.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and increased manufacturing efficiency.

Input Conditioning: STANDARD

Standard input conditioning enhances compatibility with a wide range of input signals, simplifying design requirements.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on PCBs, supporting complex layouts.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal voltage of 3.3 V is optimal for modern digital systems, reducing power consumption.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF makes it suitable for driving numerous devices while maintaining signal integrity.

Power Supplies (V): 2/5.5

Support for a wide range of supply voltages (2 to 5.5 V) allows versatility in various application environments.

No. of Terminals: 16

A 16-terminal configuration provides ample connections for complex logic and control functions.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style minimizes footprint and maximizes layout options, important for space-constrained designs.

Maximum I (ol): 8 Amp

High output current capability (8 A) makes it suitable for driving larger loads and reducing the need for additional stages.

Propagation Delay (tpd): 18 ns

With a propagation delay of 18 ns, this part supports reasonably high-speed applications while maintaining performance.

Maximum Operating Temperature: 125 °C

The ability to operate up to 125 °C allows deployment in harsh environments, enhancing reliability.

Minimum Operating Temperature: -55 °C

The wide temperature range (-55 °C) ensures functionality in extreme cold, making it ideal for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

A high-quality terminal finish guarantees excellent conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout options, aiding in compact designs.

Maximum Seated Height: 1.2 mm

A low seated height helps achieve a compact assembly profile in space-sensitive designs.

Width: 4.4 mm

The compact width allows for denser placement on PCBs, optimizing space usage.

Output Polarity: TRUE

True output polarity ensures the integrity of the output signals, suitable for a variety of logic designs.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage enhances power efficiency, allowing for battery-operated applications.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum reflow time of 40 seconds ensures compatibility with modern soldering processes, improving manufacturing yield.

Peak Reflow Temperature (°C): 260

A peak reflow temperature of 260 °C supports standard soldering techniques, important for reliable assembly.

Length: 5 mm

The short length facilitates placement in space-constrained environments, perfect for compact circuit designs.

Temperature Grade: MILITARY

Designed to military standards, this product offers high reliability and durability for critical applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it suitable for battery-operated applications.

Terminal Form: GULL WING

The gull-wing terminal form is optimized for surface mounting, facilitating easier soldering and assembly.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for more compact designs and improves layout density on circuit boards.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in supply design, accommodating a range of applications.

Technical Specifications

Decoder & Drivers 74VHC238TTR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Family:

AHC/VHC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

74VHC238TTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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