Loading...

74VHC03TTR

STMicroelectronics

74VHC03TTR by STMicroelectronics

74VHC03TTR from STMicroelectronics is a CMOS logic gate with a propagation delay of just 8.5 ns and operates b/w 2-5.5 V. It features four functions, two inputs, and supports surface mount applications in compact designs. Ideal for military-grade electronics, it withstands temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,400

-

-

-

-

Vyrian

USA . 3,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,369

-

-

-

-

Anansix

USA . 1,591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,591

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 876 parts In-Stock

1+ parts

$4.534

100+ parts

-

1k+ parts

$4.353

10k+ parts

$4.353

876

$4.534

-

$4.353

$4.353

AZTECH Wire

Italy . 981 parts In-Stock

1+ parts

$17.170

100+ parts

-

1k+ parts

-

10k+ parts

-

981

$17.170

-

-

-

IDEA Electronic Components Group

UK . 1,445 parts In-Stock

1+ parts

$21.988

100+ parts

-

1k+ parts

$19.789

10k+ parts

-

1,445

$21.988

-

$19.789

-

Microchip USA

USA . 205 parts In-Stock

1+ parts

$30.487

100+ parts

-

1k+ parts

-

10k+ parts

-

205

$30.487

-

-

-

MKK Technologies

India . 1,470 parts In-Stock

1+ parts

$41.347

100+ parts

-

1k+ parts

-

10k+ parts

-

1,470

$41.347

-

-

-

DigiPath Technology Company

USA . 1,470 parts In-Stock

1+ parts

$41.347

100+ parts

-

1k+ parts

-

10k+ parts

-

1,470

$41.347

-

-

-

Component Stockers USA

USA . 273 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

273

$99.990

-

-

-

Assy Fe

Spain . 2,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,090

-

-

-

-

Corphita

USA . 1,721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,721

-

-

-

-

Parana Technologies

USA . 1,328 parts In-Stock

1+ parts

-

100+ parts

$26.290

1k+ parts

-

10k+ parts

-

1,328

-

$26.290

-

-

Northwest PG Solutions

USA . 767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

767

-

-

-

-

Native Components

USA . 357 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

357

-

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Speed Components Ltd (Excess)

Israel . 37 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37

-

-

-

-

Overview

Unlock a world of reliability and performance with the 74VHC03TTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This logic gate is engineered for efficiency, enabling rapid switching and seamless integration in diverse applications—from automotive systems to consumer electronics. With its compact size and robust design, this versatile component ensures your projects thrive, delivering unmatched value and peace of mind. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay allows for faster switching times, enabling high-speed operations in digital circuits.

Surface Mount: YES

Surface mount technology provides a compact design and ease of integration into modern circuit boards, making it ideal for space-constrained applications.

No. of Functions: 4

Having multiple functions in one IC reduces component count and simplifies circuit design, saving space and costs.

No. of Inputs: 2

With two inputs, this logic gate can handle a variety of logic operations, providing versatility for different designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space while facilitating easy placement and soldering.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V is compatible with many modern systems, supporting efficient power usage.

Load Capacitance (CL): 50 pF

The specified load capacitance supports reliable operation in digital circuits, ensuring stable performance under different loads.

Power Supplies (V): 2/5.5

Operating on a wide range of supply voltages enhances flexibility for integration in various electronic systems.

No. of Terminals: 14

A 14-terminal configuration allows for multiple connections, suitable for complex applications that require more interfacing options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save valuable PCB space, making this component perfect for compact designs.

Maximum I (ol): 8 Amp

The capability to handle up to 8 Amps opens the door for high-performance applications where significant current might be needed.

Propagation Delay (tpd): 13 ns

An additional propagation delay specification allows for precise timing analysis in designs, ensuring synchronization and efficiency.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this gate can perform reliably in demanding environments and applications.

Output Characteristics: OPEN-DRAIN

Open-drain outputs provide flexibility in interfacing with other devices, enabling easy logic level translation and wired logic configurations.

Minimum Operating Temperature: -55 °C

The ability to function at very low temperatures ensures reliability in extreme conditions, suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium finishing materials enhance solderability and improve reliability, ensuring longevity in circuit connections.

Terminal Position: DUAL

Dual terminal positioning facilitates easy mounting on PCBs, allowing for efficient assembly processes.

Maximum Seated Height: 1.2 mm

A low seated height is advantageous for low-profile designs, enabling compact assemblies in various applications.

Width: 4.4 mm

A narrow width assists in fitting multiple components in space-constrained layouts, making it easier to manage real estate on PCBs.

Minimum Supply Voltage (Vsup): 2 V

Operating at a minimum supply voltage of 2V presents flexibility in power management, suitable for a variety of power supply arrangements.

Length: 5 mm

The compact length ensures that this gate can easily fit into tight spaces on circuit boards, promoting design flexibility.

Temperature Grade: MILITARY

The military-grade temperature classification ensures robustness and reliability in harsh conditions, ideal for defense applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this gate ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide a stable connection, simplifying the manufacturing process.

Packing Method: TR

Tape and reel packaging allows for efficient automated handling during assembly, streamlining production workflows.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for dense packing of components on PCBs, optimizing space utilization.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate up to 5.5V grants compatibility with a wide range of electronic designs, accommodating diverse operational needs.

Technical Specifications

Logic Gates 74VHC03TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC03TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20