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74VCX16373TTR

STMicroelectronics

74VCX16373TTR by STMicroelectronics

74VCX16373TTR by STMicroelectronics is a dual 8-bit bus driver with a propagation delay of just 4 ns, operating b/w 1.8V and 3.6V. It features a compact SO thin profile package and supports high-speed data transfer in military applications. With a max load capacitance of 30 pF, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,794 parts In-Stock

1+ parts

-

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8,794

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Digiode

USA . 2,739 parts In-Stock

1+ parts

-

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2,739

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Anansix

USA . 2,720 parts In-Stock

1+ parts

-

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2,720

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,009 parts In-Stock

1+ parts

$9.093

100+ parts

-

1k+ parts

$8.729

10k+ parts

$8.729

4,009

$9.093

-

$8.729

$8.729

AZTECH Wire

Italy . 393 parts In-Stock

1+ parts

$10.320

100+ parts

-

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-

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-

393

$10.320

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IDEA Electronic Components Group

UK . 1,213 parts In-Stock

1+ parts

$10.529

100+ parts

-

1k+ parts

$9.476

10k+ parts

-

1,213

$10.529

-

$9.476

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Microchip USA

USA . 158 parts In-Stock

1+ parts

$11.237

100+ parts

-

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158

$11.237

-

-

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$11.716

100+ parts

$10.662

1k+ parts

$9.607

10k+ parts

-

100

$11.716

$10.662

$9.607

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MKK Technologies

India . 1,036 parts In-Stock

1+ parts

$19.800

100+ parts

-

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1,036

$19.800

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DigiPath Technology Company

USA . 1,036 parts In-Stock

1+ parts

$19.800

100+ parts

-

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1,036

$19.800

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Corohmni

South Africa . 162 parts In-Stock

1+ parts

$30.939

100+ parts

-

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162

$30.939

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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Parana Technologies

USA . 2,108 parts In-Stock

1+ parts

-

100+ parts

$12.590

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2,108

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$12.590

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Corphita

USA . 1,336 parts In-Stock

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1,336

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Northwest PG Solutions

USA . 144 parts In-Stock

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144

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Native Components

USA . 64 parts In-Stock

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64

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Overview

Elevate your designs with the 74VCX16373TTR from STMicroelectronics—a trusted name in innovation and quality. This high-performance bus driver & transceiver ensures lightning-fast data transfer and exceptional reliability, making it ideal for diverse applications, from industrial to consumer electronics. Experience the benefits of robust signal integrity and power efficiency, all packaged in a compact design that easily integrates into your projects, delivering unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and reliability, ensuring the product can withstand various environmental conditions.

Propagation Delay At Nominal Supply: 4 ns

With a low propagation delay, this product is ideal for high-speed applications, ensuring quick data transmission.

Surface Mount: YES

The surface mount capability allows for easier and more compact PCB designs, catering to modern electronic assemblies.

No. of Functions: 2

Offering dual functions enhances flexibility and allows for more complex circuit designs using a single component.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCB layouts, making it suitable for high-density projects.

No. of Bits: 8

An 8-bit configuration supports a wide range of applications, balancing performance and the complexity of the circuit.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is compatible with many low-power systems, making it suitable for energy-efficient designs.

Load Capacitance (CL): 30 pF

With a load capacitance of 30 pF, this product is capable of driving sufficient load in high-speed applications.

Power Supplies (V): 3.3

Compatible with 3.3V power supply systems, ensuring versatility in various electronic systems.

No. of Terminals: 48

A higher number of terminals allows for more interconnections, enhancing its usability in complex circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch are ideal for space-constrained applications, enabling compact designs.

Maximum I (ol): 24 Amp

With the ability to handle up to 24 Amps, this product is suitable for high-power applications, ensuring reliability under load.

Propagation Delay (tpd): 9 ns

A propagation delay of 9 ns is sufficient for maintaining data integrity in medium-speed applications.

Maximum Operating Temperature: 125 °C

Designed to operate at high temperatures, making it suitable for demanding environments in industrial applications.

Output Characteristics: 3-STATE

3-state output characteristics provide versatility in communication protocols, allowing for better data management in bus systems.

Minimum Operating Temperature: -55 °C

The ability to function in extreme low temperatures makes it ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent solderability and corrosion resistance, enhancing longevity.

Terminal Position: DUAL

Dual terminal positioning provides additional layout flexibility, facilitating easier integration into various designs.

No. of Ports: 2

Having two ports allows for broader connectivity options, making it suitable for multi-device communication applications.

Maximum Seated Height: 1.2 mm

A low seated height optimizes space utilization on PCBs, beneficial for compact electronic devices.

Width: 6.1 mm

A moderate width allows for easy integration into various designs while supporting multiple terminal configurations.

Output Polarity: TRUE

True output polarity helps in ensuring consistent performance in digital signal applications.

Minimum Supply Voltage (Vsup): 1.8 V

Lower supply voltage capability makes this product suitable for modern low-power electronic circuits.

Length: 12.5 mm

A manageable length facilitates easy integration in both prototyping and production designs.

Temperature Grade: MILITARY

MILITARY grade ensures extreme reliability and durability, making it suitable for harsh and demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, which is essential for modern digital applications.

Terminal Form: GULL WING

Gull wing terminal form provides excellent attachment and reliability for surface mount applications.

Packing Method: TR

Tape and reel packaging facilitates automated assembly processes, saving time and reducing assembly errors.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density layouts, making it suitable for compact designs.

Maximum Supply Voltage (Vsup): 3.6 V

Compatibility with a maximum supply voltage of 3.6V supports a wide range of electronic applications.

Technical Specifications

Bus Driver & Transceivers 74VCX16373TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74VCX16373TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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