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74LVX86MTR

STMicroelectronics

74LVX86MTR by STMicroelectronics

74LVX86MTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 14.5 ns and operates at a supply voltage of 2-3.6 V. It features four functions with dual inputs, ideal for compact electronic applications. Its military-grade design ensures reliability in extreme temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,273 parts In-Stock

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Zilex Electronics Inc.

Canada . 5,000 parts In-Stock

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Anansix

USA . 2,045 parts In-Stock

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2,045

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Digiode

USA . 1,250 parts In-Stock

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1,250

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Distributors (Availability)

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Native Components

USA . 149 parts In-Stock

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$1.538

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149

$1.538

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Northwest PG Solutions

USA . 274 parts In-Stock

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$1.692

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274

$1.692

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

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$15.455

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$15.455

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AZTECH Wire

Italy . 421 parts In-Stock

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$18.190

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421

$18.190

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IDEA Electronic Components Group

UK . 67 parts In-Stock

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$30.091

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$27.082

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67

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$27.082

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MKK Technologies

India . 512 parts In-Stock

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$56.585

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512

$56.585

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DigiPath Technology Company

USA . 512 parts In-Stock

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$56.585

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512

$56.585

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Component Stockers USA

USA . 508 parts In-Stock

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$99.990

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Microchip USA

USA . 5,698 parts In-Stock

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Parana Technologies

USA . 824 parts In-Stock

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$35.979

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$35.979

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Corphita

USA . 600 parts In-Stock

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Overview

Unlock the potential of your designs with the 74LVX86MTR from STMicroelectronics, a leader in innovative semiconductor solutions. This robust logic gate excels in speed and reliability, making it perfect for demanding applications in automotive, industrial, and consumer electronics. With a compact surface-mount package and exceptional performance across extreme temperatures, it ensures your projects operate flawlessly while enhancing efficiency and longevity. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 14.5 ns

The low propagation delay ensures high-speed performance, making it ideal for fast logic operations.

Surface Mount: YES

This product is designed for surface mounting, facilitating easy integration into modern PCB designs.

No. of Functions: 4

Having multiple functions in a single package increases versatility and reduces the need for additional components.

No. of Inputs: 2

With two inputs, this logic gate can handle various logical operations efficiently, suitable for complex circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, fitting well in compact designs.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal supply voltage of 2.7 V allows for energy-efficient operation, lowering power consumption in portable devices.

Load Capacitance (CL): 50 pF

The moderate load capacitance ensures stable operation in various applications while maintaining speed.

Power Supplies (V): 3.3

Compatible with 3.3 V power supplies, this product is well-suited for contemporary digital circuit designs.

No. of Terminals: 14

A larger number of terminals facilitates numerous connection options, enhancing flexibility in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables space-saving on PCBs, making it ideal for compact electronics.

Maximum I (ol): 4 Amp

A high maximum output current rating allows this logic gate to drive larger loads, increasing its practical applications.

Propagation Delay (tpd): 21 ns

This delay specification, while slightly higher than the nominal supply delay, still supports an efficient speed of operation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this logic gate can function reliably in extreme conditions.

Minimum Operating Temperature: -55 °C

The ultra-low minimum operating temperature extends the product's usability to harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability in connections.

Terminal Position: DUAL

Dual terminal positioning simplifies mounting on PCBs, enhancing design flexibility.

Maximum Seated Height: 1.75 mm

The low seated height is advantageous in low-profile designs, meeting space constraints in compact electronics.

Width: 3.9 mm

This width allows for effective component spacing on PCBs, facilitating organized layouts.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2 V allows for compatibility with a variety of voltage levels, enhancing flexibility.

Maximum Time At Peak Reflow Temperature (s): 40

A longer reflow time can lead to better solder joints, increasing reliability in manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature is conducive to modern soldering techniques, ensuring strong mechanical connections.

Length: 8.65 mm

This length contributes to a compact overall footprint, making this logic gate suitable for space-constrained applications.

Temperature Grade: MILITARY

The military temperature grade indicates high reliability and endurance in demanding environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal design allows for easy soldering and excellent mechanical stability on the PCB.

Packing Method: TR

Tape and reel packing facilitates automated assembly, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

This terminal pitch provides a good balance between space-saving design and availability of connection points.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V allows for the flexibility to work with a range of supply voltages in various applications.

Technical Specifications

Logic Gates 74LVX86MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

21 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LVX86MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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