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74LVX4245MTR

STMicroelectronics

74LVX4245MTR by STMicroelectronics

74LVX4245MTR by STMicroelectronics is an 8-bit bus driver and transceiver with a propagation delay of just 9 ns, supporting both 3.3V and 5V systems. It features a compact SO package with dual terminals, ideal for military applications. Operating b/w -55 °C to 125°C, it ensures reliable performance in harsh environments.

Median Price

$0.850

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 5 parts In-Stock

1+ parts

$0.850

100+ parts

$0.630

1k+ parts

$0.550

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5

$0.850

$0.630

$0.550

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Vyrian

USA . 2,271 parts In-Stock

1+ parts

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2,271

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Digiode

USA . 2,144 parts In-Stock

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2,144

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Anansix

USA . 1,632 parts In-Stock

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1,632

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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1,000

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R&J Components

USA . 74 parts In-Stock

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74

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Distributors (Availability)

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Native Components

USA . 275 parts In-Stock

1+ parts

$0.039

100+ parts

-

1k+ parts

-

10k+ parts

$0.038

275

$0.039

-

-

$0.038

Andel Nordic

Denmark . 344 parts In-Stock

1+ parts

$5.810

100+ parts

-

1k+ parts

$5.577

10k+ parts

$5.577

344

$5.810

-

$5.577

$5.577

IDEA Electronic Components Group

UK . 391 parts In-Stock

1+ parts

$10.925

100+ parts

-

1k+ parts

$9.832

10k+ parts

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391

$10.925

-

$9.832

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AZTECH Wire

Italy . 995 parts In-Stock

1+ parts

$20.110

100+ parts

-

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995

$20.110

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Microchip USA

USA . 498 parts In-Stock

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$20.512

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498

$20.512

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MKK Technologies

India . 1,895 parts In-Stock

1+ parts

$20.544

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1,895

$20.544

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DigiPath Technology Company

USA . 1,895 parts In-Stock

1+ parts

$20.544

100+ parts

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1,895

$20.544

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QUARKTWIN TECHNOLOGY LTD

USA . 20,014 parts In-Stock

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Corphita

USA . 4,074 parts In-Stock

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4,074

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Northwest PG Solutions

USA . 1,851 parts In-Stock

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1,851

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Parana Technologies

USA . 1,610 parts In-Stock

1+ parts

-

100+ parts

$13.062

1k+ parts

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1,610

-

$13.062

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A-Z Elektronik GmbH

Germany . 1,458 parts In-Stock

1+ parts

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1,458

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Overview

Unlock seamless connectivity and robust performance with the 74LVX4245MTR from STMicroelectronics. This advanced bus driver & transceiver ensures reliable data transmission across your projects, delivering exceptional quality backed by a trusted manufacturer. With its versatility in handling both 3V and 5V systems, it’s perfect for a range of applications—from consumer electronics to industrial automation. Experience high reliability and efficiency that empowers your designs while keeping costs down!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures reliability and durability against environmental factors.

Propagation Delay At Nominal Supply: 9 ns

With a propagation delay of just 9 ns at nominal supply, this product allows for high-speed data transmission, suitable for fast applications.

Surface Mount: YES

The surface mount capability makes this device easy to integrate into compact circuit designs, saving space on PCBs.

Package Shape: RECTANGULAR

A rectangular package shape optimizes board layout and facilitates more efficient placement of components.

No. of Bits: 8

Having 8 bits allows for handling a byte of data, which is essential for a wide range of digital applications.

Translation: 3V & 5V

Supports translation between 3V and 5V levels, making it versatile for mixed-voltage systems.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V provides efficient power consumption, making the device suitable for battery-powered applications.

Power Supplies (V): 3.3, 5

The flexibility to operate with 3.3V or 5V supplies ensures compatibility with various systems.

No. of Terminals: 24

With 24 terminals, this product supports complex system interfacing and connections.

Package Style (Meter): SMALL OUTLINE

The small outline package style promotes a compact design, essential for modern electronics requiring space efficiency.

Maximum I (ol): 24 Amp

A maximum output current of 24 A indicates the capability to drive heavy loads, making it suitable for demanding applications.

Propagation Delay (tpd): 11 ns

The propagation delay of 11 ns signifies that the device performs well under varying load conditions, enhancing its reliability.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this component is well-suited for high-temperature environments.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for multiple devices to share the same data bus, improving design flexibility.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C means the product is suitable for extreme environments, including aerospace and military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish ensures excellent conductivity and resistance to corrosion, ensuring long-term performance.

Terminal Position: DUAL

The dual terminal position allows for diverse mounting options, increasing versatility in placement on PCBs.

No. of Ports: 2

Having 2 ports enables bi-directional communication without the need for additional components, simplifying design.

Maximum Seated Height: 2.65 mm

With a low profile (2.65 mm max seated height), this product is ideal for space-constrained applications.

Width: 7.5 mm

A width of 7.5 mm allows for dense packing on PCBs, making it suitable for various electronics.

Output Polarity: TRUE

True output polarity ensures logical consistency within your circuit, enhancing design reliability.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7V broadens compatibility with low-voltage systems, enhancing design flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures the integrity of the solder joints during assembly.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C allows for compatibility with lead-free soldering processes, promoting sustainability.

Length: 15.4 mm

The length of 15.4 mm provides a compact footprint, making it a great fit for high-density applications.

Temperature Grade: MILITARY

Rated for military temperature grade ensures reliability in critical environments, such as defense and aerospace.

Technology: CMOS

The use of CMOS technology guarantees low power consumption, contributing to energy-efficient designs.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and improved thermal performance.

Packing Method: TR

Tray packing ensures safe and organized delivery of components, facilitating easy handling during manufacturing.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is common in many applications, making layout design intuitive and straightforward.

Count Direction: BIDIRECTIONAL

Bidirectional capability enhances flexibility, allowing for versatile data flow in communication systems.

Control Type: COMMON CONTROL

Common control type simplifies the design and implementation of bus systems, promoting more efficient circuit design.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the component can be processed with standard solder reflow while ensuring reliability in varying environments.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V supports a wide application range, making the component highly versatile in design.

Technical Specifications

Bus Driver & Transceivers 74LVX4245MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

PORT A OPERATES AT 4.5V TO 5.5V

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3,5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

7.5 mm

Trade Compliance

74LVX4245MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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