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74LVX3245MTR

STMicroelectronics

74LVX3245MTR by STMicroelectronics

74LVX3245MTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 9ns, operating at a nominal voltage of 3V. It features translation b/w 3V and 5V, outputting in TRUE polarity with a max I (ol) of 24A. Ideal for bidirectional applications requiring common control in military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,881 parts In-Stock

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Anansix

USA . 2,314 parts In-Stock

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Digiode

USA . 1,518 parts In-Stock

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1,518

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Nova Conductors

Japan . 100 parts In-Stock

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VNN

France . 13 parts In-Stock

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J2 Sourcing AB

Sweden . 6 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 434 parts In-Stock

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$6.000

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434

$6.000

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Andel Nordic

Denmark . 95 parts In-Stock

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$7.599

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$7.295

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$7.295

95

$7.599

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$7.295

Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$17.678

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$16.087

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$14.496

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$17.678

$16.087

$14.496

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AZTECH Wire

Italy . 333 parts In-Stock

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$18.576

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Corohmni

South Africa . 288 parts In-Stock

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$20.819

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Microchip USA

USA . 441 parts In-Stock

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$22.197

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IDEA Electronic Components Group

UK . 880 parts In-Stock

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$26.145

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$23.531

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$26.145

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MKK Technologies

India . 1,068 parts In-Stock

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$49.165

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DigiPath Technology Company

USA . 1,068 parts In-Stock

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$49.165

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Component Stockers USA

USA . 703 parts In-Stock

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$99.990

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$99.990

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Continental Prestige Electronics

USA . 6,886 parts In-Stock

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Argo Parts USA

USA . 4,225 parts In-Stock

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Parana Technologies

USA . 1,254 parts In-Stock

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$31.261

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Corphita

USA . 541 parts In-Stock

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Bastille Electronics

Australia . 400 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 3 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Elevate your electronics projects with the 74LVX3245MTR by STMicroelectronics, a top-tier bus driver and transceiver that delivers unparalleled quality and reliability. With a small outline package style and true output polarity, this versatile component is ideal for a wide range of applications. Designed to provide seamless translation between 3V and 5V power supplies, this product offers customers unmatched value and performance. Trust in STMicroelectronics' reputation for excellence and choose the 74LVX3245MTR for all your circuit driving needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to damage, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 9 ns

Low propagation delay ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Compact and standardized shape for easy integration into various electronic systems.

No. of Bits: 8

Provides sufficient data bits for accurate and precise communication between devices.

Nominal Supply Voltage / Vsup (V): 3

Optimal voltage supply for efficient performance and compatibility with standard power sources.

Power Supplies (V): 3.3,5

Supports multiple power supply options to accommodate different operating environments and requirements.

No. of Terminals: 24

Sufficient terminals for establishing connections and ensuring seamless operation within a circuit.

Output Characteristics: 3-STATE

3-state output allows for flexibility in signal control and manipulation, enhancing the versatility of the product.

Minimum Operating Temperature: -55 °C

Wide temperature range tolerance ensures reliable operation in extreme environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving efficiency and reliability.

Technical Specifications

Bus Driver & Transceivers 74LVX3245MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

PORT B OPERATES AT 4.5V TO 5.5V

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3,5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

7.5 mm

Trade Compliance

74LVX3245MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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