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74LVX27TTR

STMicroelectronics

74LVX27TTR by STMicroelectronics

74LVX27TTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 12.5 ns and operates at a nominal voltage of 3.3 V. It features three functions and supports surface mount applications in compact designs. Ideal for military-grade electronics, it withstands temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,119 parts In-Stock

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Anansix

USA . 1,456 parts In-Stock

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Digiode

USA . 1,322 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 68 parts In-Stock

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$8.980

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-

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68

$8.980

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Ampacity Inc.

Singapore . 328 parts In-Stock

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$24.000

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328

$24.000

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IDEA Electronic Components Group

UK . 1,255 parts In-Stock

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$26.156

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$23.540

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$26.156

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Microchip USA

USA . 257 parts In-Stock

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$28.579

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257

$28.579

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MKK Technologies

India . 965 parts In-Stock

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$49.184

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965

$49.184

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DigiPath Technology Company

USA . 965 parts In-Stock

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$49.184

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$49.184

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Component Stockers USA

USA . 237 parts In-Stock

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$99.990

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Corphita

USA . 4,394 parts In-Stock

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Parana Technologies

USA . 1,446 parts In-Stock

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$31.273

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Northwest PG Solutions

USA . 992 parts In-Stock

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Native Components

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Overview

Unlock unparalleled performance with the 74LVX27TTR from STMicroelectronics, a leader in semiconductor innovation. Designed for reliability and efficiency, this robust logic gate ensures swift signal processing in a compact package, perfect for high-density applications. With its exceptional temperature tolerance and low power consumption, it empowers everything from consumer electronics to industrial automation, delivering unmatched value to your projects. Experience the STMicroelectronics advantage and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable in various applications.

Propagation Delay At Nominal Supply: 12.5 ns

A low propagation delay indicates fast switching speeds, enhancing performance in high-speed digital circuits.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic devices, saving space on PCBs.

No. of Functions: 3

Multiple functions in one package provide versatility, allowing designers to simplify circuit designs and reduce component count.

No. of Inputs: 3

Three inputs allow for complex logic operations, improving the capability of digital logic designs.

Package Shape: RECTANGULAR

The rectangular shape is standard for many applications, making it easy to fit into various layouts and PCB designs.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V allows for energy-efficient designs, crucial for battery-operated devices.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF is suitable for most applications, ensuring compatibility with other components.

Power Supplies (V): 3.3

Compatible with 3.3V power supplies, this device is ideal for many standard digital applications.

No. of Terminals: 14

With 14 terminals, there are plenty of connections available for various input and output configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this part suitable for high-density applications where space is limited.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps allows for driving substantial loads, making this device suitable for a variety of power applications.

Propagation Delay (tpd): 17 ns

Though slightly higher than the nominal delay, a 17 ns propagation delay is still effective for many digital communications scenarios.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature indicates reliability in harsh conditions, suitable for industrial and military applications.

Minimum Operating Temperature: -55 °C

Operating in extremely low temperatures ensures functionality in adverse environments, making it a good choice for military and aerospace applications.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

High-quality terminal finishes improve solderability and enhance the durability of connections, contributing to long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for versatile layout designs in compact spaces.

Maximum Seated Height: 1.2 mm

A low seated height ensures compatibility with ultra-thin profiles in modern electronic devices.

Width: 4.4 mm

A width of 4.4 mm is manageable for most PCB layouts, facilitating easier design processes.

Minimum Supply Voltage (Vsup): 2 V

Operating down to a minimum supply voltage of 2V allows flexibility for lower-power applications.

Length: 5 mm

The compact length makes it suitable for miniaturized devices, aligning with modern trends in electronics.

Temperature Grade: MILITARY

MILITARY grade classification ensures stringent quality, reliability, and performance standards for critical applications.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections, reducing assembly complexity.

Packing Method: TR

Tape and reel (TR) packing ensures efficient handling and automated assembly processes, ideal for high-volume production.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm enables high-density packaging, accommodating more components in compact designs.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this part is safe for use in a variety of applications without risk of damage.

Technical Specifications

Logic Gates 74LVX27TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3/e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

12.5 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVX27TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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