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74LVX27MTR

STMicroelectronics

74LVX27MTR by STMicroelectronics

74LVX27MTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 12.5 ns and operates at a nominal voltage of 3.3 V. It features three functions and supports surface mount applications in compact designs. Ideal for military-grade electronics, it withstands temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,440 parts In-Stock

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Digiode

USA . 4,134 parts In-Stock

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Anansix

USA . 1,250 parts In-Stock

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Native Components

USA . 531 parts In-Stock

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$0.058

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$0.055

531

$0.058

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$0.055

Microchip USA

USA . 451 parts In-Stock

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$0.314

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451

$0.314

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AZTECH Wire

Italy . 98 parts In-Stock

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$18.400

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98

$18.400

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IDEA Electronic Components Group

UK . 1,821 parts In-Stock

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$21.597

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$19.437

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$21.597

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MKK Technologies

India . 787 parts In-Stock

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$40.612

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$40.612

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DigiPath Technology Company

USA . 787 parts In-Stock

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$40.612

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Corphita

USA . 3,153 parts In-Stock

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Parana Technologies

USA . 1,302 parts In-Stock

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$25.822

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Northwest PG Solutions

USA . 753 parts In-Stock

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Overview

Elevate your designs with the 74LVX27MTR from STMicroelectronics, a premier choice in logic gates renowned for its reliability and superior performance. Engineered for precision, this device offers rapid propagation delays and robust temperature tolerance, making it ideal for both consumer electronics and sophisticated industrial applications. Trust in STMicroelectronics' legacy of quality to enhance efficiency and innovation in your projects. Experience exceptional value and seamless integration today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 12.5 ns

A low propagation delay allows for faster signal processing, which enhances the overall performance of circuits.

Surface Mount: YES

Surface mount technology enables compact design and ease of assembly, improving manufacturing efficiency.

No. of Functions: 3

Multiple functions in a single chip provide design flexibility and reduce board space requirements.

No. of Inputs: 3

With three inputs, this logic gate can handle complex logic operations, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular package shape is conducive to efficient layout and space optimization on PCBs.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage strikes a balance between performance and power consumption, suitable for battery-operated devices.

Load Capacitance (CL): 50 pF

The specified load capacitance makes it ideal for driving other logic components without significant distortion in signals.

Power Supplies (V): 3.3

Compatibility with a standard power supply voltage of 3.3V ensures ease of integration into existing systems.

No. of Terminals: 14

Having 14 terminals provides ample connectivity for input and output relationships, enhancing circuit complexity management.

Package Style (Meter): SMALL OUTLINE

A small outline package style minimizes space usage on PCBs, making it ideal for compact electronics.

Maximum I (ol): 4 Amp

The ability to handle up to 4 Amps makes this gate suitable for powering more demanding components.

Propagation Delay (tpd): 17 ns

A consistent propagation delay informs designers that performance will be predictable across various conditions.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliability in extreme environments, essential for military and industrial applications.

Minimum Operating Temperature: -55 °C

The extended low-temperature range enables usage in cold climates and under challenging conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish provides excellent conductivity and resistance to corrosion for improved longevity.

Terminal Position: DUAL

Dual terminal positioning facilitates versatile alignment during assembly, improving manufacturing processes.

Maximum Seated Height: 1.75 mm

A low seated height enhances its compatibility with compact designs, where vertical space is a constraint.

Width: 3.9 mm

Narrow width helps in fitting circuits into tight spaces, essential for modern electronics.

Minimum Supply Voltage (Vsup): 2 V

Supports a wide range of supply voltages allowing it to adapt to various power supply scenarios.

Maximum Time At Peak Reflow Temperature (s): 40

Suitable reflow characteristics make it compatible with automated production processes, enhancing manufacturing reliability.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures robustness during soldering, which is critical for surface mount applications.

Length: 8.65 mm

Compact length contributes to space efficiency on printed circuit boards, allowing for the design of smaller devices.

Temperature Grade: MILITARY

The military grade classification guarantees reliability in critical applications, adhering to stringent performance standards.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high speed, making it suitable for battery-operated designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering alignment, enhancing the assembly reliability and quality.

Packing Method: TR

Taped packaging ensures efficient handling and placement, optimizing the production process.

Terminal Pitch: 1.27 mm

The specified terminal pitch allows for compatibility with various surface mount layouts, facilitating easier integration.

Maximum Supply Voltage (Vsup): 3.6 V

A high maximum supply voltage expands application possibilities, accommodating a wider range of electronic designs.

Technical Specifications

Logic Gates 74LVX27MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

12.5 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LVX27MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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