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74LVX132MTR

STMicroelectronics

74LVX132MTR by STMicroelectronics

74LVX132MTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 10 ns and operates at a nominal voltage of 3.3V. It features four functions with dual inputs, making it ideal for high-speed digital applications. Its compact SO package ensures efficient surface mounting in various electronic devices.

Median Price

$0.270

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 137 parts In-Stock

1+ parts

$0.270

100+ parts

$0.136

1k+ parts

-

10k+ parts

$0.090

137

$0.270

$0.136

-

$0.090

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,058 parts In-Stock

1+ parts

$0.256

100+ parts

-

1k+ parts

-

10k+ parts

-

2,058

$0.256

-

-

-

Vyrian

USA . 4,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,309

-

-

-

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Anansix

USA . 618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

618

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 137 parts In-Stock

1+ parts

$0.230

100+ parts

-

1k+ parts

-

10k+ parts

-

137

$0.230

-

-

-

Corphita

USA . 3,056 parts In-Stock

1+ parts

$0.243

100+ parts

-

1k+ parts

-

10k+ parts

-

3,056

$0.243

-

-

-

Component Stockers USA

USA . 308 parts In-Stock

1+ parts

$0.310

100+ parts

$0.150

1k+ parts

-

10k+ parts

-

308

$0.310

$0.150

-

-

Microchip USA

USA . 267 parts In-Stock

1+ parts

$1.883

100+ parts

-

1k+ parts

-

10k+ parts

-

267

$1.883

-

-

-

IDEA Electronic Components Group

UK . 57 parts In-Stock

1+ parts

$30.918

100+ parts

-

1k+ parts

$27.826

10k+ parts

-

57

$30.918

-

$27.826

-

MKK Technologies

India . 804 parts In-Stock

1+ parts

$58.138

100+ parts

-

1k+ parts

-

10k+ parts

-

804

$58.138

-

-

-

DigiPath Technology Company

USA . 804 parts In-Stock

1+ parts

$58.138

100+ parts

-

1k+ parts

-

10k+ parts

-

804

$58.138

-

-

-

Native Components

USA . 945 parts In-Stock

1+ parts

$62.325

100+ parts

-

1k+ parts

-

10k+ parts

$59.832

945

$62.325

-

-

$59.832

Northwest PG Solutions

USA . 1,355 parts In-Stock

1+ parts

$68.558

100+ parts

-

1k+ parts

-

10k+ parts

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1,355

$68.558

-

-

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Perfect Parts

USA . 13,303 parts In-Stock

1+ parts

-

100+ parts

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13,303

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Parana Technologies

USA . 1,178 parts In-Stock

1+ parts

-

100+ parts

$36.967

1k+ parts

-

10k+ parts

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1,178

-

$36.967

-

-

Overview

Elevate your designs with the 74LVX132MTR from STMicroelectronics—a powerhouse in logic gates. Renowned for its superior quality and reliability, this versatile component delivers swift performance with a propagation delay of just 10 ns. Ideal for automotive and industrial applications, it ensures seamless operation even in extreme conditions. Trust in STMicroelectronics' legacy of innovation to enhance your projects with efficiency and precision—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material provides robustness and reliability, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 10 ns

A low propagation delay ensures fast signal processing, which is essential for high-speed applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into PCB layouts.

No. of Functions: 4

With four functions integrated into one chip, this product maximizes efficiency and reduces component count in circuits.

No. of Inputs: 2

Having 2 inputs is versatile for various logical operations, enabling flexibility in design.

Package Shape: RECTANGULAR

The rectangular shape is standard and allows for efficient space usage on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common nominal voltage, making it compatible with many modern digital systems.

Load Capacitance (CL): 50 pF

With 50 pF load capacitance, this product can handle a variety of performance requirements in digital circuits.

Power Supplies (V): 3.3

Utilizing a 3.3V power supply aligns with low-power consumption specifications, making it energy efficient.

No. of Terminals: 14

The 14 terminals provide adequate connectivity options for a broad range of applications and configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package minimizes space requirements on circuit boards, aiding in compact design.

Maximum I (ol): 4 Amp

With a high output current rating of 4 Amps, this product can drive larger loads, adding to its versatility.

Propagation Delay (tpd): 13.5 ns

A propagation delay of 13.5 ns provides assurance of reliable timing performance in high-speed applications.

Maximum Operating Temperature: 125 C

Withstanding high temperatures ensures reliable performance in demanding environments.

Minimum Operating Temperature: -55 C

Ability to operate in extreme low temperatures increases durability and reliability in various climatic conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances solderability and ensures long-term reliability, improving overall product longevity.

Terminal Position: DUAL

Dual terminal position allows for flexible design and layout options in circuit integration.

Maximum Seated Height: 1.75 mm

A low seated height facilitates compact design in high-density applications, optimizing space usage.

Width: 3.9 mm

The compact width of 3.9 mm helps save PCB space, valuable in densely populated electronic devices.

Minimum Supply Voltage (Vsup): 2 V

Able to function at a minimum supply voltage of 2V ensures compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 40

A long reflow time provides robust soldering reliability, essential for high-quality manufacturing.

Peak Reflow Temperature °C: 260

High reflow temperature capability allows for compatibility with modern soldering processes and materials.

Length: 8.65 mm

The length of 8.65 mm provides a balanced footprint ideal for various electronic designs.

Temperature Grade: MILITARY

MILITARY grade implies high reliability and durability, making it ideal for critical applications.

Schmitt Trigger: YES

Incorporation of Schmitt trigger characteristics ensures clean signal transitions, enhancing signal integrity.

Technology: CMOS

CMOS technology provides lower power consumption and higher noise immunity, crucial for efficient circuitry.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and soldering ease, improving assembly processes.

Packing Method: TR

Tape and reel (TR) packing method facilitates automated handling and efficient manufacturing.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27 mm ensures compatibility with a wide range of PCB designs.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a maximum supply voltage of 3.6V, providing flexibility in power supply configuration.

Technical Specifications

Logic Gates 74LVX132MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LVX132MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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