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74LVX126TTR

STMicroelectronics

74LVX126TTR by STMicroelectronics

74LVX126TTR by STMicroelectronics is a CMOS bus driver with a 13.5 ns propagation delay, operating b/w 2-3.6 V. It features 4 functions and supports dual ports in a compact SOIC package. Ideal for high-speed data transmission in military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 35,000 parts In-Stock

1+ parts

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35,000

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ComSIT USA

USA . 35,000 parts In-Stock

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35,000

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Vyrian

USA . 6,665 parts In-Stock

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6,665

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Digiode

USA . 4,588 parts In-Stock

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4,588

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Anansix

USA . 1,375 parts In-Stock

1+ parts

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1,375

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 368 parts In-Stock

1+ parts

$1.999

100+ parts

-

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-

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368

$1.999

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Northwest PG Solutions

USA . 1,988 parts In-Stock

1+ parts

$2.198

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-

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1,988

$2.198

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Andel Nordic

Denmark . 2,355 parts In-Stock

1+ parts

$10.446

100+ parts

-

1k+ parts

$10.029

10k+ parts

$10.029

2,355

$10.446

-

$10.029

$10.029

AZTECH Wire

Italy . 295 parts In-Stock

1+ parts

$11.880

100+ parts

-

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295

$11.880

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Microchip USA

USA . 413 parts In-Stock

1+ parts

$24.911

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-

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413

$24.911

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IDEA Electronic Components Group

UK . 1,913 parts In-Stock

1+ parts

$26.790

100+ parts

-

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$24.111

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1,913

$26.790

-

$24.111

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MKK Technologies

India . 290 parts In-Stock

1+ parts

$50.378

100+ parts

-

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290

$50.378

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DigiPath Technology Company

USA . 290 parts In-Stock

1+ parts

$50.378

100+ parts

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290

$50.378

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

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15,000

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A-Z Elektronik GmbH

Germany . 6,686 parts In-Stock

1+ parts

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6,686

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Corphita

USA . 4,718 parts In-Stock

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4,718

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Parana Technologies

USA . 1,448 parts In-Stock

1+ parts

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100+ parts

$32.032

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1,448

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$32.032

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Overview

Elevate your designs with the 74LVX126TTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance bus driver is perfect for advanced applications in communication systems, enabling seamless data transfer with unmatched reliability. With its low propagation delays and robust thermal capabilities, it ensures efficient operation even in demanding environments. Trust STMicroelectronics for quality and performance that transforms your projects into success stories!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and resistance to environmental factors, making it suitable for a variety of applications.

Propagation Delay At Nominal Supply: 13.5 ns

A low propagation delay allows for faster signal processing, making this product ideal for time-sensitive applications.

Surface Mount: YES

Surface mount capability enables easier integration into compact electronic designs and helps in minimizing the circuit board footprint.

No. of Functions: 4

Multiple functions in a single package save space and reduce component count, simplifying PCB design and assembly.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of space on printed circuit boards (PCBs), allowing for better layout flexibility.

Nominal Supply Voltage / Vsup (V): 2.7

This voltage rating signifies compatibility with lower voltage systems, enhancing energy efficiency in various applications.

Power Supplies (V): 3.3

3.3V power supply is commonly used in modern digital circuits, making it versatile for integration into a wide range of electronic devices.

No. of Terminals: 14

More terminals allow for increased connectivity options, catering to diverse application needs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch optimize space usage on circuit boards, which is essential for modern compact devices.

Maximum I (ol): 4 Amp

The ability to handle up to 4 Amps allows this product to drive larger loads, making it suitable for power-intensive applications.

Propagation Delay (tpd): 15 ns

Maintaining a low propagation delay aids in precise timing applications, ensuring that the device performs effectively in fast operations.

Maximum Operating Temperature: 125 °C

A high operating temperature range makes this product suitable for use in demanding environments where temperature fluctuations are common.

Output Characteristics: 3-STATE

3-state output facilitates flexible data bus configurations, enabling multiple devices to share communication lines effectively.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature enhances its applicability in extreme conditions, ensuring reliability in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing the longevity of connections.

Terminal Position: DUAL

Dual terminal positioning aids in better handling and placement during assembly, increasing manufacturing efficiency.

No. of Ports: 2

Having two ports provides greater connectivity options for inter-device communication, making it versatile for various applications.

Maximum Seated Height: 1.2 mm

A low seated height allows for a slimmer profile on PCBs, accommodating compact designs for mobile and portable devices.

Width: 4.4 mm

The compact width makes it an excellent choice for space-constrained applications without sacrificing performance.

Output Polarity: TRUE

True output polarity simplifies circuit design as it conforms to standard logic levels, making integration straightforward.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage broadens its usability in low-power applications, making it energy efficient.

Length: 5 mm

A short length optimizes usage in tight spaces, enhancing design flexibility in small form-factor devices.

Temperature Grade: MILITARY

Military-grade components are built to withstand rigorous conditions, assuring reliability for critical applications.

Technology: CMOS

CMOS technology offers lower power consumption and higher speed, providing performance advantages in digital circuits.

Terminal Form: GULL WING

Gull wing terminals promote reliable soldering and are suitable for automatic assembly processes, enhancing production efficiency.

Packing Method: TR

Tape and reel packaging streamlines automated assembly processes, making it practical for high-volume production.

Terminal Pitch: 0.65 mm

A small terminal pitch accommodates modern compact PCB layouts, allowing for high-density designs.

Control Type: ENABLE HIGH

The enable high control simplifies the design by allowing components to activate efficiently, ensuring system responsiveness.

Maximum Supply Voltage (Vsup): 3.6 V

This voltage rating ensures compatibility with higher voltage systems, enabling flexibility in various electronic applications.

Technical Specifications

Bus Driver & Transceivers 74LVX126TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVX126TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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