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74LVX126MTR

STMicroelectronics

74LVX126MTR by STMicroelectronics

74LVX126MTR by STMicroelectronics is a CMOS bus driver with a propagation delay of 13.5 ns and operates at supply voltages from 2 to 3.6 V. It features 4 functions in a compact SO package, ideal for high-speed data transmission in military applications. With a max output current of 4 A, it ensures reliable performance under extreme temperatures (-55 °C to +125°C).

Median Price

$0.352

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,394 parts In-Stock

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Bristol Electronics

USA . 3,500 parts In-Stock

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$0.352

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$0.263

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$0.244

3,500

-

$0.352

$0.263

$0.244

Microfarads

USA . 3,374 parts In-Stock

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3,374

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Anansix

USA . 2,350 parts In-Stock

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2,350

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Digiode

USA . 1,276 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Microchip USA

USA . 479 parts In-Stock

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$9.059

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479

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Andel Nordic

Denmark . 1,402 parts In-Stock

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$9.789

100+ parts

-

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$9.398

10k+ parts

$9.398

1,402

$9.789

-

$9.398

$9.398

AZTECH Wire

Italy . 967 parts In-Stock

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$10.270

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$10.270

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IDEA Electronic Components Group

UK . 851 parts In-Stock

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$21.706

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$19.535

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851

$21.706

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$19.535

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MKK Technologies

India . 1,499 parts In-Stock

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$40.816

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$40.816

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DigiPath Technology Company

USA . 1,499 parts In-Stock

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$40.816

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$40.816

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Perfect Parts

USA . 7,549 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,993 parts In-Stock

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Corphita

USA . 4,541 parts In-Stock

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Northwest PG Solutions

USA . 1,734 parts In-Stock

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$3.737

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Native Components

USA . 839 parts In-Stock

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$3.699

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839

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Parana Technologies

USA . 793 parts In-Stock

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$25.952

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Kepictronics

USA . 475 parts In-Stock

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475

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Futuretech Components

Singapore . 475 parts In-Stock

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475

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Cyclops Electronics Ltd (Excess)

UK . 250 parts In-Stock

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250

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Overview

Unlock unparalleled performance in your designs with the 74LVX126MTR from STMicroelectronics, a leader in semiconductor innovation. This robust bus driver and transceiver ensures seamless data communication with remarkable efficiency and reliability. Ideal for high-speed applications, its compact design delivers exceptional thermal stability and power management, making it perfect for automotive and industrial use. Elevate your projects with ST's quality assurance and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 13.5 ns

This low propagation delay allows for fast switching speeds, enhancing overall system performance and responsiveness.

Surface Mount: YES

Surface mount construction enables compact PCB designs and facilitates automated assembly processes, ideal for modern electronic applications.

No. of Functions: 4

With four functions, this device offers versatility, allowing it to handle multiple tasks within a single component, thus saving space and costs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it easier to integrate into various designs.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal supply voltage of 2.7V strikes a good balance between power consumption and performance, suitable for low-voltage applications.

Power Supplies (V): 3.3

Compatible with a standard 3.3V power supply, making it highly usable in a wide range of electronic devices.

No. of Terminals: 14

The 14-terminal configuration provides ample connectivity options, ensuring flexibility in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates space-efficient designs, crucial for compact and portable devices.

Maximum I (ol): 4 Amp

With a maximum output current of 4 Amps, this component can drive larger loads, making it powerful for various applications.

Propagation Delay (tpd): 15 ns

A propagation delay of 15 ns provides fast signal transmission, which is essential in high-speed communication systems.

Maximum Operating Temperature: 125 °C

The ability to operate at a maximum temperature of 125 °C makes this device suitable for high-temperature environments, ensuring reliability.

Output Characteristics: 3-STATE

3-state output characteristics enhance versatility by allowing multiple devices to share the same communication line without interference.

Minimum Operating Temperature: -55 °C

A wide operating temperature range down to -55 °C makes this product ideal for extreme environments, such as aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish ensures excellent conductivity and corrosion resistance, leading to long-term reliability of connections.

Terminal Position: DUAL

The dual terminal position allows for flexible PCB layout options, which can simplify design and assembly processes.

No. of Ports: 2

Having two ports makes it possible to establish multiple connections, enhancing the communication flexibility within circuits.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75 mm contributes to compact circuit designs, facilitating the miniaturization of electronic devices.

Width: 3.9 mm

With a compact width of 3.9 mm, this component fits well in space-constrained applications, aiding in portable and efficient designs.

Output Polarity: TRUE

True output polarity simplifies design considerations for applications where specific voltage levels are required.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V provides flexibility in power management, making it adaptable to various power source scenarios.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum reflow time of 40 seconds ensures compatibility with various soldering processes, essential for quality board assembly.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates robustness against thermal stresses during manufacturing, ensuring device reliability.

Length: 8.65 mm

A compact length of 8.65 mm allows for efficient layout in tight spaces, making it suitable for compact electronics.

Temperature Grade: MILITARY

Military-grade specifications ensure that the product can withstand rigorous conditions, suitable for defense and aerospace industries.

Technology: CMOS

Utilizing CMOS technology enables low power consumption while maintaining high performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate reliable soldering and provide a good mechanical connection, enhancing durability in assembled devices.

Packing Method: TR

Through-hole packaging (TR) aids in easy handling and integration into automated manufacturing processes, improving throughput.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact designs while still enabling effective soldering and connectivity on PCBs.

Control Type: ENABLE HIGH

An ENABLE HIGH control type provides straightforward control logic for signaling, simplifying the design and integration in broader applications.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with most modern logic levels, making it versatile for numerous applications.

Technical Specifications

Bus Driver & Transceivers 74LVX126MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LVX126MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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