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74LVX125TTR

STMicroelectronics

74LVX125TTR by STMicroelectronics

74LVX125TTR by STMicroelectronics is a CMOS bus driver with a 13 ns propagation delay and operates at supply voltages from 2.0 to 3.6 V. It features 4 functions in a compact 14-terminal package, ideal for high-speed data transmission in military applications. Its robust design supports temperatures from -55 °C to 125°C, ensuring reliability in demanding environments.

Median Price

$0.280

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 250 parts In-Stock

1+ parts

$0.280

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250

$0.280

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DF Sales Co.

USA . 250 parts In-Stock

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$0.280

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250

$0.280

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Vyrian

USA . 6,264 parts In-Stock

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6,264

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Digiode

USA . 4,387 parts In-Stock

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Anansix

USA . 1,368 parts In-Stock

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Bristol Electronics

USA . 1,170 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 200 parts In-Stock

1+ parts

$1.178

100+ parts

-

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$1.131

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$1.131

200

$1.178

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$1.131

$1.131

Corohmni

South Africa . 643 parts In-Stock

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$11.294

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643

$11.294

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AZTECH Wire

Italy . 1,095 parts In-Stock

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$11.700

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$11.700

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Microchip USA

USA . 496 parts In-Stock

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$12.731

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496

$12.731

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IDEA Electronic Components Group

UK . 2,218 parts In-Stock

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$16.822

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$15.140

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$16.822

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MKK Technologies

India . 149 parts In-Stock

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$31.633

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$31.633

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DigiPath Technology Company

USA . 149 parts In-Stock

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$31.633

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$31.633

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$37.653

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$34.264

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$30.875

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2,000

$37.653

$34.264

$30.875

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Component Stockers USA

USA . 427 parts In-Stock

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$99.990

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427

$99.990

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Perfect Parts

USA . 2,576 parts In-Stock

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2,576

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Northwest PG Solutions

USA . 1,204 parts In-Stock

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Parana Technologies

USA . 814 parts In-Stock

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$20.114

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Corphita

USA . 476 parts In-Stock

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Native Components

USA . 167 parts In-Stock

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Overview

Unlock unparalleled performance with the 74LVX125TTR from STMicroelectronics, a leader in innovation and reliability. This robust bus driver & transceiver ensures swift data transfer across demanding applications while maintaining low power consumption. With a compact design and exceptional temperature resilience, it thrives in both commercial and military environments. Trust in ST’s excellence to elevate your projects and drive efficiency like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction enhances reliability and resistance to environmental factors.

Propagation Delay At Nominal Supply: 13 ns

Low propagation delay allows for faster signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount compatibility facilitates easy integration into modern circuit designs with limited space.

No. of Functions: 4

Multiple functions offer versatility, enabling complex logic operations in a single package.

Package Shape: RECTANGULAR

Rectangular shape aids in efficient PCB layout and space optimization.

Nominal Supply Voltage / Vsup (V): 2.7

Optimized supply voltage allows for efficient power consumption while maintaining performance.

Power Supplies (V): 3.3

Standard power supply voltage ensures compatibility with a wide range of systems.

No. of Terminals: 14

A sufficient number of terminals makes it capable of supporting comprehensive connectivity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile design ideal for space-constrained applications without compromising functionality.

Maximum I (ol): 4 Amp

High output current capability enhances its usage in power-intensive applications.

Propagation Delay (tpd): 18 ns

Reasonable propagation delay pairs well with high-speed applications, balancing performance and cost.

Maximum Operating Temperature: 125 °C

High thermal tolerance allows usage in extreme conditions, suitable for military and industrial applications.

Output Characteristics: 3-STATE

3-state output characteristics improve flexibility in hierarchical and multiplexing applications.

Minimum Operating Temperature: -55 °C

Wide temperature range supports operations in harsh environments, ideal for military specifications.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable and reliable terminal finish ensures excellent electrical connections and longevity.

Terminal Position: DUAL

Dual position terminals facilitate flexible PCB layouts and versatile usage scenarios.

No. of Ports: 2

Dual port design enables easy connection to multiple pathways or devices for improved functionality.

Maximum Seated Height: 1.2 mm

Low seated height is beneficial for designs with strict height constraints, promoting compactness.

Width: 4.4 mm

Narrow width fits well in compact designs, optimizing space on the PCB.

Output Polarity: TRUE

True output polarity enhances compatibility with standard logic levels in digital circuits.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage helps in energy-efficient designs, extending battery life in portable applications.

Length: 5 mm

Compact length aids in efficient layout design and spatial constraints on PCBs.

Temperature Grade: MILITARY

Military-grade specifications ensure robustness and reliability in critical applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable performance.

Terminal Form: GULL WING

Gull wing terminals offer excellent solderability and mechanical strength for reliable connections.

Packing Method: TR

Tape and reel packaging ensures efficient handling and automatic assembly processes.

Terminal Pitch: 0.65 mm

Smaller terminal pitch allows for high-density designs, effectively utilizing PCB real estate.

Control Type: ENABLE LOW

Low enable signal provides easy integration into systems requiring low control logic.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a wide range of supply voltages, enhancing versatility across different applications.

Technical Specifications

Bus Driver & Transceivers 74LVX125TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVX125TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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