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74LVX125MTR

STMicroelectronics

74LVX125MTR by STMicroelectronics

74LVX125MTR by STMicroelectronics is a CMOS bus driver with a propagation delay of 13 ns and operates at supply voltages from 2 to 3.6 V. It features 4 functions, supports dual ports, and is ideal for high-speed data transmission in compact applications. Its robust design withstands temperatures from -55 °C to 125°C.

Median Price

$0.541

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 7 parts In-Stock

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$0.522

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$0.522

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American Microsemiconductor Inc.

USA . 17,500 parts In-Stock

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$0.560

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$0.560

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ComSIT Distribution GmbH

Germany . 7,500 parts In-Stock

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Digiode

USA . 4,771 parts In-Stock

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Vyrian

USA . 2,864 parts In-Stock

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Inventory MP

USA . 2,500 parts In-Stock

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Bristol Electronics

USA . 2,500 parts In-Stock

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Anansix

USA . 2,350 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Andel Nordic

Denmark . 5,552 parts In-Stock

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$6.418

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-

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$6.161

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$6.161

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$6.418

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$6.161

AZTECH Wire

Italy . 731 parts In-Stock

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$8.850

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731

$8.850

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IDEA Electronic Components Group

UK . 1,040 parts In-Stock

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$21.025

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$18.922

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MKK Technologies

India . 1,984 parts In-Stock

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$39.536

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DigiPath Technology Company

USA . 1,984 parts In-Stock

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$39.536

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Microchip USA

USA . 10,184 parts In-Stock

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Corphita

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Parana Technologies

USA . 1,619 parts In-Stock

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$25.138

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Native Components

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Northwest PG Solutions

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Perfect Parts

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Overview

Elevate your design with the 74LVX125MTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance bus driver and transceiver offers exceptional reliability and efficiency, ensuring seamless communication across diverse applications—from automotive to industrial controls. With its compact design and robust temperature tolerance, you'll benefit from reduced power consumption and enhanced performance, making it the perfect choice for demanding environments. Trust in STMicroelectronics' legacy of quality and innovation to drive your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures protection against environmental factors, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 13 ns

A low propagation delay enhances data transmission speed, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for space-efficient designs and is compatible with automated assembly processes.

No. of Functions: 4

Multiple functions enable versatile use in various applications, providing flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular design aids in efficient PCB layout and maximization of available board space.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a low nominal supply voltage helps reduce power consumption, making it energy efficient.

Power Supplies (V): 3.3

Compatible with common power supply levels, allowing it to integrate easily with most systems.

No. of Terminals: 14

An adequate number of terminals provides more connection options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for modern compact electronic designs.

Maximum I (ol): 4 Amp

This high output current capability ensures sufficient power delivery for demanding applications.

Propagation Delay (tpd): 18 ns

The slightly longer propagation delay relative to the nominal supply still supports efficient data rates in most applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature, this product can function in more extreme environments, suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output allows the device to effectively manage bus systems by minimizing conflicts in multi-device setups.

Minimum Operating Temperature: -55 °C

The capability to operate at very low temperatures ensures reliability in harsh conditions, perfect for military or aerospace use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This premium finish enhances conductivity and ensures reliability over time, especially in critical applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in PCB design for improved connectivity.

No. of Ports: 2

Having two ports facilitates communication between multiple devices, essential for data bus networking.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a slim profile, crucial for compact electronic assemblies.

Width: 3.9 mm

A narrow width supports space-saving design solutions suitable for modern electronic devices.

Output Polarity: TRUE

True output polarity ensures that the logic levels are clear and avoid confusion in data signals.

Minimum Supply Voltage (Vsup): 2 V

Operating at a low minimum supply voltage makes the device versatile and compatible with a wide range of applications.

Maximum Time At Peak Reflow Temperature (s): 40

A specified peak reflow time enhances manufacturability by providing guidelines for thermal processing.

Peak Reflow Temperature °C: 260

A high peak reflow temperature allows for compatibility with lead-free soldering processes commonly used in modern PCB assembly.

Length: 8.65 mm

This compact length is ideal for tight spaces, contributing to optimal layout and integration in small PCBs.

Temperature Grade: MILITARY

Designed to meet military standards, it ensures reliability in demanding applications, making it suitable for defense technologies.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, enhancing performance and efficiency.

Terminal Form: GULL WING

The gull wing terminal form ensures secure soldering to PCBs and aids in automated assembly.

Packing Method: TR

The tape and reel packing method facilitates easy handling and automated assembly processes.

Terminal Pitch: 1.27 mm

A standard terminal pitch supports compatibility with a wide range of mounting styles and PCB designs.

Control Type: ENABLE LOW

An enable low control type simplifies design logic and allows for easy interfacing with controlling circuits.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage specification, it ensures safe operation while allowing a range of use cases.

Technical Specifications

Bus Driver & Transceivers 74LVX125MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LVX125MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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