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74LVTH16244TTR

STMicroelectronics

74LVTH16244TTR by STMicroelectronics

74LVTH16244TTR by STMicroelectronics is a high-speed bus driver with a propagation delay of just 3.2 ns, supporting 16 functions. It operates at a nominal voltage of 3.3V and features a compact SO thin profile package. Ideal for industrial applications, it ensures reliable data transmission in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,521 parts In-Stock

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4,521

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Digiode

USA . 4,120 parts In-Stock

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4,120

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Anansix

USA . 1,349 parts In-Stock

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1,349

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Distributors (Availability)

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Microchip USA

USA . 149 parts In-Stock

1+ parts

$7.280

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149

$7.280

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IDEA Electronic Components Group

UK . 690 parts In-Stock

1+ parts

$8.924

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-

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$8.032

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690

$8.924

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$8.032

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Native Components

USA . 859 parts In-Stock

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$11.010

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859

$11.010

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AZTECH Wire

Italy . 991 parts In-Stock

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$11.930

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991

$11.930

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Northwest PG Solutions

USA . 2,318 parts In-Stock

1+ parts

$12.111

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$10.900

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2,318

$12.111

$10.900

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MKK Technologies

India . 873 parts In-Stock

1+ parts

$16.781

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873

$16.781

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DigiPath Technology Company

USA . 873 parts In-Stock

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$16.781

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873

$16.781

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Component Stockers USA

USA . 498 parts In-Stock

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$99.990

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498

$99.990

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Corphita

USA . 2,695 parts In-Stock

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2,695

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Parana Technologies

USA . 2,232 parts In-Stock

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$10.670

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2,232

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$10.670

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A-Z Elektronik GmbH

Germany . 105 parts In-Stock

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Kepictronics

USA . 102 parts In-Stock

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Overview

Unlock exceptional performance and reliability with the 74LVTH16244TTR from STMicroelectronics. This advanced bus driver and transceiver excels in demanding applications, ensuring swift data transfer with minimal delay. Designed for versatility, its compact surface-mount package makes integration effortless in space-constrained designs. Trust in STMicroelectronics’ commitment to quality and innovation, empowering your projects with unmatched efficiency and durability. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for various applications.

Propagation Delay at Nominal Supply: 3.2 ns

A propagation delay of 3.2 ns allows for high-speed data transmission, which is essential in modern digital circuits.

Surface Mount: YES

The surface mount capability enables easy integration onto printed circuit boards, saving space and reducing assembly costs.

No. of Functions: 16

With 16 functions, this product provides versatility, allowing multiple operations within a single chip and reducing the need for additional components.

Package Shape: RECTANGULAR

A rectangular package shape facilitates efficient use of PCB space, allowing for compact designs.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal supply voltage of 3.3 V makes this device compatible with a wide range of digital circuits.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF contributes to faster signal transitions, enhancing overall performance.

Power Supplies (V): 3.3

A single 3.3 V power supply simplifies the design and reduces power consumption.

No. of Terminals: 48

The availability of 48 terminals allows for extensive connectivity and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a thin profile with a small footprint, which is advantageous for space-constrained applications.

Maximum I (ol): 64 Amp

The capability to handle a maximum output current of 64 Amps ensures robustness in applications requiring high current drive.

Propagation Delay (tpd): 3.7 ns

A propagation delay of 3.7 ns facilitates rapid signal processing, vital for high-speed applications.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C ensures reliability in high-temperature environments.

Output Characteristics: 3-STATE

3-state output characteristics provide flexibility for bus sharing, allowing multiple devices to communicate on the same line without interference.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C enables usage in harsh and extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for ease of mounting and enhances design flexibility.

No. of Ports: 2

With two ports, this device supports dual-channel communication, increasing the efficiency of data handling.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm allows for low-profile designs, making it suitable for compact devices.

Width: 6.1 mm

A width of 6.1 mm is optimal for fitting into tight spaces while maintaining performance.

Output Polarity: TRUE

TRUE output polarity indicates the signaling method, ensuring compatibility with various logic levels.

Minimum Supply Voltage (Vsup): 2.7 V

The ability to operate at a minimum supply voltage of 2.7 V provides flexibility for use in diverse power supply conditions.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C enables compatibility with modern soldering processes, enhancing manufacturability.

Length: 12.5 mm

A compact length of 12.5 mm contributes to the overall miniaturization of electronic designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in demanding environments.

Technology: BICMOS

Utilizing BICMOS technology provides a combination of high speed and low power consumption, optimizing performance.

Terminal Form: GULL WING

Gull wing terminal form enhances solderability and mechanical strength, offering reliable connections during assembly.

Packing Method: TR

The Tape and Reel (TR) packing method facilitates automated handling and assembly, improving manufacturing efficiency.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense packing of components on the PCB, suitable for advanced designs.

Control Type: ENABLE LOW

The ENABLE LOW control type provides a straightforward method for managing device power states, simplifying control logic.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V allows for operation within widely accepted voltage levels, ensuring compatibility across various applications.

Technical Specifications

Bus Driver & Transceivers 74LVTH16244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

16

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.2 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74LVTH16244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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