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74ALVCH16373TTR

STMicroelectronics

74ALVCH16373TTR by STMicroelectronics

74ALVCH16373TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 3.9 ns, supporting dual 8-bit functions. It operates b/w 1.65V and 3.6V, making it ideal for high-speed data transmission in compact electronic designs. Its military-grade specs ensure reliability in extreme conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,399 parts In-Stock

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7,399

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Digiode

USA . 3,438 parts In-Stock

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Anansix

USA . 1,261 parts In-Stock

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1,261

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Distributors (Availability)

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AZTECH Wire

Italy . 259 parts In-Stock

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$14.520

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259

$14.520

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IDEA Electronic Components Group

UK . 600 parts In-Stock

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$21.937

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-

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$19.744

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600

$21.937

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$19.744

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Microchip USA

USA . 394 parts In-Stock

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$24.882

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394

$24.882

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MKK Technologies

India . 2,243 parts In-Stock

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$41.252

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2,243

$41.252

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DigiPath Technology Company

USA . 2,243 parts In-Stock

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$41.252

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2,243

$41.252

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Component Stockers USA

USA . 294 parts In-Stock

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$99.990

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Corphita

USA . 4,921 parts In-Stock

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4,921

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Parana Technologies

USA . 2,288 parts In-Stock

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$26.230

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$26.230

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Northwest PG Solutions

USA . 590 parts In-Stock

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590

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Native Components

USA . 143 parts In-Stock

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Overview

Experience unmatched performance with the 74ALVCH16373TTR from STMicroelectronics, a leader in innovative semiconductor solutions. This advanced bus driver and transceiver offers exceptional speed and reliability, making it ideal for high-speed data applications across automotive, telecommunications, and industrial settings. With its compact design and superior thermal management, this component ensures seamless operation while delivering energy efficiency, empowering you to elevate your projects with confidence. Choose STMicroelectronics for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 3.9 ns

A low propagation delay indicates fast signal processing, enhancing the performance of communication systems.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making installation easier.

No. of Functions: 2

Multiple functions in one chip increase versatility and reduce component count in a design.

Package Shape: RECTANGULAR

The rectangular shape is standard for easy alignment on PCBs, simplifying design and assembly.

No. of Bits: 8

An 8-bit configuration allows for sufficient data processing capabilities in many applications.

Nominal Supply Voltage / Vsup: 2.7 V

Lower supply voltage results in reduced power consumption, making the product energy-efficient.

Load Capacitance (CL): 50 pF

Designed for low load capacitance, this product supports high-speed operation and minimizes delays.

Power Supplies (V): 3.3

Compatibility with 3.3V power supplies ensures broad compatibility with many modern digital systems.

No. of Terminals: 48

A higher number of terminals provides more connectivity options, facilitating complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are ideal for space-constrained applications, enabling compact designs.

Maximum I (ol): 24 Amp

High output current rating enables the driver to support demanding loads, making it suitable for power applications.

Propagation Delay (tpd): 7 ns

Fast propagation delay supports high-speed circuits, ensuring timely signal transmission.

Maximum Operating Temperature: 125 °C

A wide operating temperature range ensures reliability in extreme environments, suitable for industrial use.

Output Characteristics: 3-STATE

3-state output characteristics enhance flexibility in bus communication, allowing multiple devices to share the same line.

Minimum Operating Temperature: -55 °C

Ability to operate in low temperatures expands the product's usability in harsh environments.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and enhances signal integrity.

No. of Ports: 2

With two ports, the device can manage two separate communication lines, improving efficiency.

Maximum Seated Height: 1.2 mm

Low seated height is advantageous for space-saving and low-profile designs.

Width: 6.1 mm

Compact width allows for close placement of components, optimizing PCB design.

Output Polarity: TRUE

True output polarity contributes to predictable performance in time-sensitive applications.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage helps in reducing overall power consumption, extending battery life in portable devices.

Length: 12.5 mm

Standard length contributing to compatibility with various PCB layouts.

Temperature Grade: MILITARY

Military-grade specification ensures high reliability and performance in critical applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance the mechanical strength of the connection.

Packing Method: TR

The tape and reel packaging method allows for automated assembly and convenient handling.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is standard for modern devices, facilitating compatibility with various designs.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum voltage of 3.6V ensures compatibility with a wide range of digital devices and systems.

Technical Specifications

Bus Driver & Transceivers 74ALVCH16373TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74ALVCH16373TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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