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74ACT573TTR

STMicroelectronics

74ACT573TTR by STMicroelectronics

74ACT573TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 12 ns, ideal for high-speed applications. It operates at a nominal voltage of 5V and features a compact SOIC package. This device supports dual ports and offers true output characteristics, making it suitable for military-grade electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,217 parts In-Stock

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6,217

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Digiode

USA . 1,405 parts In-Stock

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1,405

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Anansix

USA . 202 parts In-Stock

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202

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Distributors (Availability)

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Andel Nordic

Denmark . 2,096 parts In-Stock

1+ parts

$5.519

100+ parts

-

1k+ parts

$5.298

10k+ parts

$5.298

2,096

$5.519

-

$5.298

$5.298

AZTECH Wire

Italy . 119 parts In-Stock

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$14.220

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119

$14.220

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IDEA Electronic Components Group

UK . 1,298 parts In-Stock

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$28.077

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$25.270

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1,298

$28.077

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$25.270

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MKK Technologies

India . 611 parts In-Stock

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$52.798

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611

$52.798

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DigiPath Technology Company

USA . 611 parts In-Stock

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$52.798

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611

$52.798

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Component Stockers USA

USA . 745 parts In-Stock

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$99.990

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745

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 26,751 parts In-Stock

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Microchip USA

USA . 4,842 parts In-Stock

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Northwest PG Solutions

USA . 2,324 parts In-Stock

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Corphita

USA . 1,086 parts In-Stock

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1,086

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Parana Technologies

USA . 985 parts In-Stock

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$33.571

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$33.571

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Native Components

USA . 290 parts In-Stock

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Overview

Unlock seamless data communication with the 74ACT573TTR from STMicroelectronics—a trusted leader in innovative semiconductor solutions. Designed for superior performance and reliability, this 8-bit bus driver excels in demanding applications, ensuring swift signal transmission with a low propagation delay of just 12 ns. Crafted for durability and efficiency, its compact design fits perfectly in space-constrained environments, empowering your projects with unparalleled quality and versatility. Choose STMicroelectronics for excellence you can rely on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures resistance to environmental stress and reliable performance.

Propagation Delay At Nominal Supply: 12 ns

The low propagation delay allows for fast data transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount compatibility facilitates compact designs and automated assembly, enhancing production efficiency.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the circuit board.

No. of Bits: 8

With 8 bits, this device can handle a wide range of applications, providing flexibility in design.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V makes it compatible with standard logic levels and easy to integrate.

Load Capacitance (CL): 50 pF

The manageable load capacitance supports efficient signal integrity in various circuit configurations.

Power Supplies (V): 5

Operates at a single 5V supply, simplifying power management in devices.

No. of Terminals: 20

The 20-terminal configuration allows for extensive connectivity options in applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch design enhances space-saving capabilities on circuit boards.

Maximum I (ol): 24 Amp

A high output current capability allows this device to drive significant loads, making it versatile for various applications.

Propagation Delay (tpd): 12 ns

This repeat value of propagation delay confirms consistent performance in data transmission rates.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes it suitable for demanding environments without risk of failure.

Output Characteristics: 3-STATE

3-state output characteristics enable multiple devices to connect on the same bus, improving circuit design efficiency.

Minimum Operating Temperature: -55 °C

The wide operating temperature range ensures reliable performance in extreme conditions.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible layout options on the PCB.

No. of Ports: 2

With 2 ports, this transceiver can manage multiple data lines, useful in complex circuit designs.

Maximum Seated Height: 1.1 mm

A low seated height allows for placement in slim applications, contributing to overall design efficiency.

Width: 4.4 mm

The compact width helps save PCB real estate, beneficial for miniaturized electronic designs.

Output Polarity: TRUE

True polarity output enhances compatibility with standard logic levels in most digital circuits.

Minimum Supply Voltage (Vsup): 4.5 V

The flexibility in supply voltage range allows for diverse applications without stringent power supply constraints.

Length: 6.5 mm

A short length contributes to compact designs, ideal for space-constrained applications.

Temperature Grade: MILITARY

This military grade ensures high reliability and performance in demanding and rugged environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, essential for modern electronic devices.

Terminal Form: GULL WING

Gull wing terminal form simplifies handling and soldering processes, enhancing manufacturing ease.

Packing Method: TR

Tape and reel packing helps in efficient handling and automated processes in production environments.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is ideal for high-density PCB layouts, suitable for advanced electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, ensuring appropriate handling during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage provides margin for power supply variations, enhancing device reliability.

Technical Specifications

Bus Driver & Transceivers 74ACT573TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3/e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74ACT573TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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