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74ACT14MTR

STMicroelectronics

74ACT14MTR by STMicroelectronics

74ACT14MTR by STMicroelectronics is a CMOS Schmitt Trigger logic gate with a 14 ns propagation delay and operates at a nominal voltage of 5V. It features 6 functions in a compact SO package, ideal for high-speed applications. With a max temp of 125 °C, it's suitable for military use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,305 parts In-Stock

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Digiode

USA . 4,684 parts In-Stock

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4,684

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Anansix

USA . 2,310 parts In-Stock

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2,310

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Native Components

USA . 262 parts In-Stock

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$0.287

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$0.276

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$0.287

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$0.276

Northwest PG Solutions

USA . 1,552 parts In-Stock

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$0.316

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$0.278

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$0.278

Microchip USA

USA . 326 parts In-Stock

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$0.403

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326

$0.403

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IDEA Electronic Components Group

UK . 2,221 parts In-Stock

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$14.788

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$13.309

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$14.788

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$13.309

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AZTECH Wire

Italy . 845 parts In-Stock

1+ parts

$15.790

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845

$15.790

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MKK Technologies

India . 975 parts In-Stock

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$27.808

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$27.808

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DigiPath Technology Company

USA . 975 parts In-Stock

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$27.808

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$27.808

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Component Stockers USA

USA . 735 parts In-Stock

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$99.990

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 11,169 parts In-Stock

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Corphita

USA . 3,256 parts In-Stock

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Parana Technologies

USA . 456 parts In-Stock

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$17.681

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Overview

Unlock unparalleled performance with the 74ACT14MTR from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile logic gate delivers rapid response times and exceptional reliability across diverse applications—from consumer electronics to industrial automation. Experience the benefits of advanced Schmitt Trigger technology, ensuring precision and efficiency in every operation. Elevate your projects with a solution that embodies quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material enhances the product's longevity and reliability.

Propagation Delay At Nominal Supply: 14 ns

Fast switching speeds make this logic gate suitable for high-frequency applications.

Surface Mount: YES

Allows for compact design and is compatible with modern manufacturing processes.

No. of Functions: 6

Versatile functionality supports multiple applications in one package, reducing component count.

Package Shape: RECTANGULAR

Standardized shape facilitates easy mounting and integration into various circuit designs.

Nominal Supply Voltage / Vsup: 5 V

Standard voltage level suitable for a wide range of digital applications.

Load Capacitance (CL): 50 pF

Allows for stable operation in a variety of load conditions, making it suitable for diverse applications.

Power Supplies (V): 5

Single supply voltage simplifies power distribution in electronic circuits.

No. of Terminals: 14

Adequate number of terminals facilitates multiple connections and increased circuit complexity.

Package Style (Meter): SMALL OUTLINE

Compact size reduces space requirements on PCBs, enabling more efficient designs.

Maximum I (ol): 24 Amp

High output current capability allows it to drive larger loads effectively.

Propagation Delay (tpd): 14 ns

Repeatability of high-speed performance ensures consistency in circuit behavior.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes it suitable for demanding environments and applications.

Minimum Operating Temperature: -55 °C

Wide operating temperature range enhances application flexibility in extreme conditions.

Terminal Finish: TIN

Tin plating offers excellent solderability and reduces oxidation for reliable connections.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility and simplifies PCB design.

Maximum Seated Height: 1.75 mm

Low profile design helps in maintaining a slim form factor for compact enclosures.

Width: 3.9 mm

Narrow dimensions enable better space management on PCBs.

Minimum Supply Voltage (Vsup): 4.5 V

Flexibility with supply voltage ensures compatibility with a variety of systems.

Length: 8.65 mm

Compact length allows for tighter packing of components, optimizing layout efficiency.

Temperature Grade: MILITARY

Meets military specifications, ensuring reliability in critical applications.

Schmitt Trigger: YES

Incorporating Schmitt trigger functionality improves noise immunity and signal integrity.

Technology: CMOS

CMOS technology offers low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability and ease of handling.

Packing Method: TR

Tape and reel packaging facilitates automated assembly and improves manufacturing efficiency.

Terminal Pitch: 1.27 mm

Optimized terminal pitch allows for compatibility with standard PCB layout practices.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for some margin in supply voltage, increasing design flexibility and resilience.

Technical Specifications

Logic Gates 74ACT14MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74ACT14MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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