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VN920SP-E

STMicroelectronics

VN920SP-E by STMicroelectronics

VN920SP-E by STMicroelectronics is a peripheral driver with a max supply voltage of 36V and a max output current of 30A. It is used as a buffer or inverter based peripheral driver, providing protection against transient, over current, over voltage, thermal, and under voltage conditions.

Median Price

$2.183

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$2.183

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-

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98

$2.183

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Chip Stock

USA . 7,020 parts In-Stock

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7,020

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Vyrian

USA . 3,708 parts In-Stock

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3,708

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Anansix

USA . 2,018 parts In-Stock

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2,018

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Digiode

USA . 857 parts In-Stock

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857

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 538 parts In-Stock

1+ parts

$2.183

100+ parts

-

1k+ parts

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10k+ parts

$2.139

538

$2.183

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-

$2.139

Netroflash

USA . 100 parts In-Stock

1+ parts

$2.183

100+ parts

$2.139

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-

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100

$2.183

$2.139

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Argo Parts USA

USA . 7 parts In-Stock

1+ parts

$2.183

100+ parts

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7

$2.183

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Aztec Data Supply Inc.

USA . 3,182 parts In-Stock

1+ parts

$9.510

100+ parts

-

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3,182

$9.510

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Corohmni

South Africa . 68 parts In-Stock

1+ parts

$13.540

100+ parts

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68

$13.540

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$13.698

100+ parts

$13.013

1k+ parts

$13.013

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-

200

$13.698

$13.013

$13.013

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IDEA Electronic Components Group

UK . 14 parts In-Stock

1+ parts

$13.723

100+ parts

-

1k+ parts

$12.350

10k+ parts

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14

$13.723

-

$12.350

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AZTECH Wire

Italy . 593 parts In-Stock

1+ parts

$15.166

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593

$15.166

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MKK Technologies

India . 2,253 parts In-Stock

1+ parts

$25.805

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2,253

$25.805

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DigiPath Technology Company

USA . 2,253 parts In-Stock

1+ parts

$25.805

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2,253

$25.805

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Ampacity Inc.

Singapore . 1,120 parts In-Stock

1+ parts

$29.500

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1,120

$29.500

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Microchip USA

USA . 282 parts In-Stock

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$34.953

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282

$34.953

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Semicontronic

India . 490 parts In-Stock

1+ parts

$37.500

100+ parts

$36.562

1k+ parts

$36.375

10k+ parts

-

490

$37.500

$36.562

$36.375

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Lixinc

USA . 14,915 parts In-Stock

1+ parts

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14,915

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Perfect Parts

USA . 6,132 parts In-Stock

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6,132

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Corphita

USA . 1,900 parts In-Stock

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1,900

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Parana Technologies

USA . 1,303 parts In-Stock

1+ parts

-

100+ parts

$16.408

1k+ parts

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1,303

-

$16.408

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Robosynatics

Brazil . 300 parts In-Stock

1+ parts

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100+ parts

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300

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

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100+ parts

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300

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Overview

Discover the VN920SP-E by STMicroelectronics, a high-quality peripheral driver that brings unmatched performance to your applications. With its reliable manufacturing from STMicroelectronics, a trusted leader in the industry, this product offers exceptional value and benefits to customers. Designed with built-in protections against transient events, over current, over voltage, thermal issues, and under voltage, it ensures the safety and longevity of your systems. Ideal for a range of applications, this compact and efficient device delivers a maximum output current of 30A and operates within a supply voltage range of 5.5V to 36V. Upgrade your projects with the VN920SP-E and experience unparalleled performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this peripheral driver durable and resistant to various environmental conditions.

Surface Mount: YES

The surface mount feature of this peripheral driver allows for easy and hassle-free installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 36 V

With a maximum supply voltage of 36V, this peripheral driver can handle higher voltage input signals, making it suitable for a wide range of applications.

No. of Functions: 1

This peripheral driver has 1 function, simplifying circuit design and reducing complexity while still providing the necessary functionality.

Package Shape: RECTANGULAR

The rectangular package shape of this driver allows for efficient utilization of space on the circuit board, maximizing the overall system design.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections in this peripheral driver, such as transient, over current, over voltage, thermal, and under voltage, ensure safe and reliable operation, protecting both the driver and the connected peripherals.

Power Supplies (V): 8/36

The wide range of power supply options, from 8V to 36V, make this peripheral driver adaptable to different power sources and systems, providing flexibility in various applications.

No. of Terminals: 10

With 10 terminals, this peripheral driver offers sufficient connections for interfacing with other components and peripherals, enabling seamless integration within a system.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style with a heat sink/slug design provides effective heat dissipation, ensuring optimal performance and reliability under high load conditions.

Minimum Supply Voltage: 5.5 V

This peripheral driver can operate efficiently even with a minimum supply voltage of 5.5V, making it suitable for low-power applications and ensuring energy efficiency.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin (Sn) annealed terminal finish enhances solderability, ensuring a secure and reliable electrical connection during assembly.

Terminal Position: DUAL

The dual terminal position allows for flexibility in circuit layout and provides options for different configurations, adapting to various design requirements.

Maximum Seated Height: 3.65 mm

With a maximum seated height of 3.65mm, this peripheral driver offers a compact profile, making it suitable for space-constrained applications.

Width: 7.5 mm

The width of 7.5mm ensures compactness and a smaller footprint, enabling efficient utilization of space on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

This peripheral driver can withstand peak reflow temperatures for up to 30 seconds, ensuring reliability during the soldering process.

Peak Reflow Temperature °C: 250

The peak reflow temperature capability of 250°C ensures compatibility with standard soldering processes, making assembly convenient and reliable.

Length: 9.4 mm

The length of 9.4mm offers a compact form factor, enabling the driver to be integrated into systems with limited space without compromising functionality.

Maximum Output Current: 30 A

With a maximum output current of 30A, this peripheral driver can drive high-power loads efficiently, making it suitable for applications requiring robust performance.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable solder joint, enhancing the overall durability and performance of the peripheral driver.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V ensures stable and consistent power delivery, contributing to the reliable operation and performance of the driver.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for easy and accurate PCB layout, facilitating efficient integration into the overall system design.

Driver No. of Bits: 1

This peripheral driver has a single bit, simplifying its operation and making it suitable for applications requiring basic signal control or switching.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level (MSL) rating of 3 ensures the driver's safe storage and handling, minimizing the risk of moisture-related issues during assembly and operation.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This peripheral driver features a buffer or inverter-based interface IC type, allowing for versatile signal processing and compatibility with various peripheral devices.

Output Current Flow Direction: SOURCE

The output current flow direction being sourced enhances compatibility with other circuit components and enables seamless integration into the overall system architecture.

Technical Specifications

Peripheral Drivers VN920SP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

30 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VN920SP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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