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VN920DSPTR-E

STMicroelectronics

VN920DSPTR-E by STMicroelectronics

VN920DSPTR-E by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact 10-terminal design for efficient surface mounting. Ideal for automotive applications, it supports output currents up to 45A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,416 parts In-Stock

1+ parts

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2,416

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Vyrian

USA . 2,132 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,132

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ComSIT Distribution GmbH

Germany . 522 parts In-Stock

1+ parts

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522

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Digiode

USA . 439 parts In-Stock

1+ parts

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-

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439

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Pegasus Components GmbH

Germany . 211 parts In-Stock

1+ parts

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211

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,286 parts In-Stock

1+ parts

$11.658

100+ parts

-

1k+ parts

$10.492

10k+ parts

-

1,286

$11.658

-

$10.492

-

AZTECH Wire

Italy . 619 parts In-Stock

1+ parts

$14.710

100+ parts

-

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619

$14.710

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-

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MKK Technologies

India . 570 parts In-Stock

1+ parts

$21.923

100+ parts

-

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570

$21.923

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DigiPath Technology Company

USA . 570 parts In-Stock

1+ parts

$21.923

100+ parts

-

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10k+ parts

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570

$21.923

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Microchip USA

USA . 287 parts In-Stock

1+ parts

$61.692

100+ parts

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287

$61.692

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Corphita

USA . 4,676 parts In-Stock

1+ parts

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4,676

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Parana Technologies

USA . 51 parts In-Stock

1+ parts

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100+ parts

$13.939

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51

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$13.939

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Overview

Elevate your designs with the VN920DSPTR-E by STMicroelectronics—a pinnacle of reliability and innovation in peripheral drivers. With built-in protections against transient spikes, overcurrent, and thermal issues, this compact solution ensures optimal performance across applications like automotive and industrial automation. Trust in STMicroelectronics' legacy of excellence to deliver unmatched value, enabling you to create robust systems that stand the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mounting allows for compact designs and efficient use of PCB space, making it ideal for modern electronics.

Maximum Supply Voltage: 36 V

Supporting a maximum supply voltage of 36 V enhances versatility and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB while allowing for effective heat dissipation.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protections ensure the device operates safely under various conditions, increasing reliability and lifespan.

Power Supplies (V): 8/36

Supports a broad input voltage range, providing flexibility in powering different devices and systems.

No. of Terminals: 10

Ten terminals enable a range of connections for input, output, and control signals, enhancing functionality.

Package Style (Meter): SMALL OUTLINE

Small outline design reduces space requirements on the circuit board, which is essential for compact electronics.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage allows it to work with a wider variety of systems, including battery-operated devices.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning facilitates easier layout on PCBs, improving design efficiency.

Maximum Seated Height: 3.65 mm

A compact seated height minimizes PCB profile, making it suitable for low-profile applications.

Width: 7.5 mm

A width of 7.5 mm provides a balanced size for versatile applications while fitting comfortably into various designs.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 250

Designed to endure high reflow temperatures, this product meets industry standards for soldering without compromising integrity.

Length: 9.4 mm

A length of 9.4 mm contributes to a compact design, enabling use in tight spaces within electronic devices.

Maximum Output Current: 0.005 A

A defined maximum output current ensures safe and reliable operation within specified limits.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, enhancing production efficiency.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V optimally supports the device’s operation in standard applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easy routing on PCBs and compatibility with various mounting techniques.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the product's reliability for manufacturing and soldering processes, with standard moisture handling.

Nominal Output Peak Current Limit: 45 A

A peak current limit of 45 A allows the device to handle high power requirements, making it suitable for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Offering a versatile interface type enhances compatibility with various logic levels and peripheral devices.

Output Current Flow Direction: SOURCE

The source output current flow direction enables effective interfacing with loads, providing reliable performance.

Technical Specifications

Peripheral Drivers VN920DSPTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.005 A

Nominal Output Peak Current Limit:

45 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VN920DSPTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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