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VN920DSP13TR

STMicroelectronics

VN920DSP13TR by STMicroelectronics

VN920DSP13TR from STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and supports output currents up to 25A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,357 parts In-Stock

1+ parts

-

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3,357

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Vyrian

USA . 3,328 parts In-Stock

1+ parts

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3,328

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Anansix

USA . 1,844 parts In-Stock

1+ parts

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100+ parts

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1,844

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 438 parts In-Stock

1+ parts

$11.522

100+ parts

-

1k+ parts

$10.370

10k+ parts

-

438

$11.522

-

$10.370

-

AZTECH Wire

Italy . 1,217 parts In-Stock

1+ parts

$19.000

100+ parts

-

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-

10k+ parts

-

1,217

$19.000

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MKK Technologies

India . 1,983 parts In-Stock

1+ parts

$21.667

100+ parts

-

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10k+ parts

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1,983

$21.667

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DigiPath Technology Company

USA . 1,983 parts In-Stock

1+ parts

$21.667

100+ parts

-

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10k+ parts

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1,983

$21.667

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-

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Microchip USA

USA . 469 parts In-Stock

1+ parts

$64.222

100+ parts

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1k+ parts

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469

$64.222

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 5,225 parts In-Stock

1+ parts

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5,225

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Corphita

USA . 1,753 parts In-Stock

1+ parts

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1,753

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Parana Technologies

USA . 734 parts In-Stock

1+ parts

-

100+ parts

$13.776

1k+ parts

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10k+ parts

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734

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$13.776

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Overview

Experience unmatched reliability and performance with the VN920DSP13TR from STMicroelectronics. This cutting-edge peripheral driver is designed for diverse applications, ensuring robust protection against overcurrent, overvoltage, and thermal risks. With a compact footprint and exceptional power handling, it effortlessly enhances your designs while minimizing space. Trust in STMicroelectronics’ legacy of quality to deliver the efficiency and durability your projects demand—empowering your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy in the package body ensures longevity and reliability in various operating environments.

Surface Mount: YES

Surface mount technology allows for space-efficient designs and simplified automated assembly processes.

Maximum Supply Voltage: 36 V

A maximum supply voltage of 36 V provides flexibility for use in different applications requiring higher voltage ranges.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board layout and component placement, promoting efficient space utilization.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protections ensure device safety and reliability, protecting against common electrical issues that could lead to failure.

Power Supplies (V): 8/36

A wide operating voltage range (8 to 36 V) allows versatility for various applications, giving designers more options.

No. of Terminals: 10

The 10 terminals provide ample connectivity options for integration into existing systems, enhancing design flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact applications, saving space without sacrificing performance.

Minimum Supply Voltage: 5.5 V

A minimum supply voltage of 5.5 V allows compatibility with lower-voltage systems while maintaining performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates more flexible circuit design, allowing for tighter layouts and enhanced performance.

Maximum Seated Height: 3.65 mm

A maximum seated height of 3.65 mm allows the component to fit into low-profile designs, ideal for portable devices.

Width: 7.5 mm

A width of 7.5 mm strikes a balance between compactness and accessibility for connection in a variety of applications.

Maximum Time At Peak Reflow Temperature: 30 s

With a peak reflow temperature duration of 30 seconds, this component is optimized for thermal management during assembly.

Peak Reflow Temperature: 250 °C

A peak reflow temperature of 250 °C provides stability during soldering, preventing damage to the component during manufacturing.

Length: 9.4 mm

A length of 9.4 mm allows compact integration onto PCB while still maintaining thermal and electrical performance.

Maximum Output Current: 25 A

A maximum output current of 25 A suits high-power applications, ensuring reliable operation under load.

Terminal Form: GULL WING

Gull wing terminal form enhances solder connection reliability, improving mechanical stability on the PCB.

Nominal Supply Voltage: 13 V

Nominal operation at 13 V ensures optimal performance in standard applications, making it a suitable choice for many designs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for uniform spacing on PCBs, making assembly and soldering easier.

Moisture Sensitivity Level (MSL): 3

MSL level 3 means this device can withstand moderate moisture exposure, enhancing reliability during handling and assembly.

Nominal Output Peak Current Limit: 45 A

The peak current limit of 45 A ensures this product can handle surges in demanding applications where high current is necessary.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based peripheral driver enhances versatility in interfacing with various devices and logic levels.

Output Current Flow Direction: SINK

Output current flowing in the sink direction aligns with common application needs, allowing straightforward design integration.

Technical Specifications

Peripheral Drivers VN920DSP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Maximum Output Current:

25 A

Nominal Output Peak Current Limit:

45 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VN920DSP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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