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SPC58EC74E7P001X

STMicroelectronics

SPC58EC74E7P001X by STMicroelectronics

SPC58EC74E7P001X microcontroller by STMicroelectronics features a 32-bit E200Z4 CPU, operates at 1.14-1.26V, and supports up to 40MHz clock speed. With integrated DMA channels and AEC-Q100 screening, it's ideal for automotive applications. Its compact design includes 176 terminals in a low-profile package.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 10,091 parts In-Stock

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Anansix

USA . 826 parts In-Stock

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Digiode

USA . 584 parts In-Stock

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584

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AZTECH Wire

Italy . 1,191 parts In-Stock

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$21.300

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IDEA Electronic Components Group

UK . 257 parts In-Stock

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$67.166

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$60.449

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MKK Technologies

India . 613 parts In-Stock

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$126.300

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DigiPath Technology Company

USA . 613 parts In-Stock

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$126.300

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Parana Technologies

USA . 1,354 parts In-Stock

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$80.307

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Corphita

USA . 967 parts In-Stock

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Overview

Unlock the potential of your next project with the SPC58EC74E7P001X microcontroller from STMicroelectronics, a leader in cutting-edge innovation. Engineered for superior performance in automotive and industrial applications, this robust chip ensures reliability and efficiency under extreme conditions, while its compact design saves space. Experience seamless connectivity and enhanced processing power, enabling you to create smarter, more responsive solutions that stand out in today's competitive market. Choose excellence; choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and reliability in various operating environments.

Integrated Cache: YES

Integrated cache improves data access speed, enhancing overall system performance.

Surface Mount: YES

Surface mount design supports compact applications and simplifies PCB assembly.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage allows for low-power designs, making it ideal for battery-operated devices.

On Chip Data RAM Width: 8

Wide RAM width allows for efficient data processing and handling, boosting performance.

Screening Level: AEC-Q100

AEC-Q100 certification indicates suitability for automotive applications, ensuring reliability in critical environments.

Package Shape: SQUARE

Square package shape facilitates efficient space usage on a PCB, making integration easier.

Bit Size: 32

A 32-bit architecture provides enhanced performance for complex computations and applications.

No. of Terminals: 176

A high number of terminals allows for extensive connectivity options and interfacing with other devices.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This versatile package style offers flexibility in device mounting and thermal management.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage aids in energy efficiency, making this microcontroller suitable for low-power applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for deployment in harsh environments, increasing application versatility.

CPU Family: E200Z4

The E200Z4 CPU family is known for its performance and energy efficiency, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Extremely low minimum operating temperature ensures reliable performance in frigid conditions.

ADC Channels: YES

Includes ADC channels for direct analog signal processing, enhancing functionality in sensor applications.

DMA Channels: YES

DMA channels enable high-speed data transfer, freeing up CPU resources and improving processing efficiency.

Terminal Position: QUAD

Quad terminal position allows for efficient PCB layout and easier soldering, enhancing assembly reliability.

ROM Words: 3145728

Large ROM capacity supports complex applications, allowing for extensive program storage.

Maximum Seated Height: 1.6 mm

Low profile makes it suitable for compact designs where space is a constraint.

Width: 24 mm

Standard width facilitates compatibility with existing hardware designs and PCB layouts.

Data EEPROM Size: 128K

Adequate EEPROM size for storing configuration data, enabling greater functionality in applications.

Boundary Scan: YES

Features boundary scan for easy testing and debugging, improving reliability and reducing development time.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Diverse peripheral set enhances application capabilities and simplifies system design.

Maximum Clock Frequency: 40 MHz

High clock frequency accelerates processing speed, which is beneficial for performance-demanding applications.

Length: 24 mm

Standard length aids in compatibility and ease of integration with existing systems.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction processing, contributing to better performance and lower power consumption.

No. of Timers: 12

Multiple timers provide extensive timing and control options, enabling complex application scenarios.

RAM Bytes: 393216

Sufficient RAM size supports data-heavy applications, improving performance and responsiveness.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it suitable for various applications.

Terminal Form: GULL WING

Gull wing terminals provide easy handling and better solder joint quality for reliable connections.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

Capable ADCs enhance precision in reading analog signals, improving data accuracy.

Maximum Supply Current: 50 mA

Moderate supply current allows for a balance between performance and power requirements in designs.

Nominal Supply Voltage: 1.2 V

Low nominal supply voltage supports energy-efficient designs, making it suitable for portable applications.

No. of DMA Channels: 64

High number of DMA channels aids in efficient data handling and reduces CPU load.

No. of Serial I/Os: 26

A wide array of serial I/O options facilitates diverse connectivity for various communication protocols.

PWM Channels: YES

Presence of PWM channels allows for control of motors and other devices, enhancing functionality.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Rich connectivity options enable versatile communication interfaces for various applications.

ROM Programmability: FLASH

Flash programmability provides flexibility for updates and changes in application code without replacing the chip.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact designs while ensuring adequate spacing for soldering.

Format: FLOATING POINT

Floating point format capabilities enhance the microcontroller's ability to handle complex mathematical computations.

Speed: 160 rpm

Speed capability allows for efficient operation in applications requiring quick response times.

Low Power Mode: YES

Low power mode extends battery life in portable applications by reducing energy consumption during idle periods.

On Chip Program ROM Width: 8

Wide program ROM width enables effective handling of larger codebases, supporting advanced applications.

Technical Specifications

Microcontrollers SPC58EC74E7P001X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC74E7P001X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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