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H5TQ4G63MFR-RDI

Sk Hynix

H5TQ4G63MFR-RDI by Sk Hynix

DDR3 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

DRAM H5TQ4G63MFR-RDI attributes and parameters. Explore more DRAM devices from Sk Hynix

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Access Time:

.195 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

933 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

4,8

JESD-30 Code:

R-PBGA-B96

Length:

13 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-45 Cel

Organization:

256MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

4,8

Maximum Standby Current:

.02 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

300 mA

Maximum Supply Voltage (Vsup):

1.575 V

Minimum Supply Voltage (Vsup):

1.425 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9.4 mm

Trade Compliance

H5TQ4G63MFR-RDI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Sk Hynix

A Solution Provider Leading the Global ICT Ecosystem With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees. SK hynix is committed to becoming a solution provider, which leads the global ICT ecosystem through paradigm-shifting hyper collaboration with our global partners. Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in search of more social value and a healthier governance structure. SK hynix will rise to become a “Global Top-Tier Technology Company”, which contributes to humanity and society.

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