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MD27C256-20

Signetics

MD27C256-20 by Signetics

UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;

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MD27C256-20 by Signetics
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Technical Specifications

EPROM MD27C256-20 attributes and parameters. Explore more EPROM devices from Signetics

Specs

Maximum Access Time:

200 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T28

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Programming Voltage (V):

12.5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Standby Current:

.0002 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MD27C256-20 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Signetics

Signetics - Philips - NXP Company Overview Signetics, once a major player in semiconductor manufacturing, made a variety of devices which included integrated circuits, bipolar and MOS, the Dolby circuit, logic, memory, analog circuits and Motorola clone CPUs. Signetics was acquired by Philips Semiconductor in 1975. Philips Semiconductors, headquartered in Eindhoven, The Netherlands, is one of the world's top semiconductor suppliers. Our ambition is to be the leading provider of semiconductor-based solutions for connected consumer and communications applications. Philips Semiconductors is a leading supplier of silicon system solutions for mobile communications, consumer electronics, digital displays, contactless payment and connectivity, and in-car entertainment and networking. Philips Semiconductor was spun off from Philips in August, 2006 to form NXP Semiconductors.

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