Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
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Andel Nordic
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$6.292
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$6.040
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$28.000
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SRAM R1WV6416RBG-7SI#S0 attributes and parameters. Explore more SRAM devices from Renesas Electronics
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R1WV6416RBG-7SI#S0 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
OHN3140U
Tt Electronics Plc
OHN3140U by Tt Electronics Plc is a magnetic field sensor with a max supply voltage of 24V and hysteresis of 2mT. It features an output range of 25mA and operates b/w -20 to 85°C. Ideal for applications requiring precise detection and measurement of magnetic fields in various industries.
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
BAV99WT1G
Onsemi
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
1N4148
American Power Devices
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
STM8S003F3P6TR
STMicroelectronics
STM8S003F3P6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 RAM bytes, 128 data EEPROM size, and 5-ch 10-bit ADC channels. Ideal for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART interfaces.
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
SBAV99LT1G
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
5962-8685910LA
Performance Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .001 Amp;
5962-8685924YA
Matra Design Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 22; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
CY7C1049G30-10ZSXIT
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
DS1225Y-200
Maxim Integrated
DS1225Y-200 by Maxim Integrated is a 8Kx8 SRAM with 8192 words, 65536 bit memory density, and 200 ns access time. Ideal for commercial applications requiring non-volatile memory in microelectronic assemblies. Operating at 5V with low standby current of 0.005A makes it suitable for various electronic devices.
CY7C1079DV33-12BAXIT
Infineon's CY7C1079DV33-12BAXIT is a 3.3V SRAM with 4MX8 organization, 12ns access time, and 48 terminals in a thin profile grid array package. Ideal for industrial applications requiring fast and reliable parallel memory storage with common I/O type and 3-state output characteristics.
SN74LS189AN
Texas Instruments
SN74LS189AN by Texas Instruments is a 16x4 SRAM with 3-STATE output. It operates asynchronously at temperatures ranging from 0 to 70°C. Ideal for commercial applications, this TTL technology memory IC has a max access time of 80ns and uses parallel terminal form.
70V08L20PFGI
Renesas Electronics
Renesas Electronics' 70V08L20PFGI is a 64Kx8 DUAL-PORT SRAM with 3.3V supply, operating at -40 to 85 °C. It features a 0.5mm terminal pitch, 20ns access time, and industrial temperature grade. Ideal for applications requiring fast and reliable data storage in harsh environments.
IDT71321LA20JG8
Integrated Device Technology
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Width: 19.1262 mm;
74F189PC
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
7028L20PFGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Length: 14 mm;
IDT71256SA15YGI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOJ; Package Shape: RECTANGULAR; Memory Density: 262144 bit;
5962-8685916LA
Pyramid Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;
CY7C1061G30-10ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
CY62128ELL-45SXIT
Infineon's CY62128ELL-45SXIT is a 128Kx8 SRAM with 45ns access time, operating at 5V. It features asynchronous mode, common I/O type, and 3-state output characteristics. Ideal for industrial applications requiring fast and reliable memory storage in compact designs.
HM628512BLFP-7
Renesas Electronics' HM628512BLFP-7 is a 512Kx8 SRAM with 70ns access time, operating at 5V. It features a small outline package, common I/O type, and 3-state output characteristics. Ideal for applications requiring fast and reliable memory storage in electronic devices.
CY62167G30-45BVXA
Infineon's CY62167G30-45BVXA is a 1MX16 SRAM with 45ns access time, operating at 3.6V. It features a very thin profile grid array package suitable for industrial applications requiring fast and reliable memory storage. With common I/O type and output enable function, it offers high-speed parallel data processing capabilities in harsh environments.
AS6C8008-55ZIN
Alliance Memory
AS6C8008-55ZIN by Alliance Memory is a 1MX8 SRAM with 55 ns access time, operating at 3V. It features a small outline package and is ideal for industrial applications requiring fast and reliable memory storage. With 8388608 bit density, this CMOS technology-based chip offers common I/O type and 3-state output characteristics.
CY14E256LA-SZ25XI
Infineon's CY14E256LA-SZ25XI is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package and industrial temperature grade, suitable for applications requiring fast access times like industrial automation and automotive systems.
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 22; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
5962-8685908LA
Defense Logistics Agency
Defense Logistics Agency's 5962-8685908LA SRAM features 16KX4 organization, CMOS technology, and 45 ns max access time. Ideal for military applications with MIL-STD-883 screening level, this memory IC operates asynchronously at temperatures ranging from -55 to 125 °C.
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R1WV6416RBG-5SI#B0
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 67108864 bit;
R1WV6416RBG-5SI
STANDARD SRAM; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY; Maximum Operating Temperature: 85 Cel;
R1WV6416RBG-7SR
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Alternate Memory Width: 8;
R1WV6416RBG-7SR#B0
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
R1WV6416RBG-7SI#B0
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, FINE PITCH;
R1WV3216RSD-8SR
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: TSSOP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
R1WV3216RBG-8SR
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
R1WV6416RBG-5SR
STANDARD SRAM; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Organization: 4MX16; Maximum Operating Temperature: 70 Cel;
R1WV6416RBG-5SI#S0
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
R1WV3216RSD-7SI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP52,.4,16;
R1WV6416RBG-7SI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Alternate Memory Width: 8;
R1WV6416RBG-5SR#B0
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Technology: CMOS;
R1WV3216RSD-8SI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
R1WV3216RBG-8SI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Current: 70 mA;
R1WV3216RBG-7SR
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
R1WV3216RBG-7SI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 20;
R1WV3216RBG-7SR#B0
STANDARD SRAM; Moisture Sensitivity Level (MSL): 3;
R1WV3216RSD-7SR
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
R1WV6416RBG-5SR#S0
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; No. of Words: 4194304 words;
Renesas Technology
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;
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