Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
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SRAM R1WV3216RBG-7SR attributes and parameters. Explore more SRAM devices from Renesas Electronics
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R1WV3216RBG-7SR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
MMBT3906LT1G
Onsemi
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
1N4148
Dc Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Bytesonic Electronics
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Microsemi
MBR0520LT1
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
DS18B20Z
Maxim Integrated
DS18B20Z by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring precise temperature monitoring in compact spaces.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
1N4148WS
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Infinex
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
2N7002
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
Bourns
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
7028L15PFG8
Renesas Electronics
Renesas Electronics 7028L15PFG8 is a 64Kx16 SRAM with 5V supply, operating in asynchronous mode. Featuring 3-STATE output and parallel interface, it has a max access time of 15ns. Ideal for applications requiring fast and reliable memory storage in commercial-grade environments.
IDT71V547S100PFGI
The Renesas Electronics IDT71V547S100PFGI is a 128Kx36 ZBT SRAM with synchronous operation, 10ns access time, and 3.3V nominal voltage. It is ideal for industrial applications requiring high-speed parallel memory solutions in a compact flatpack package with low profile design.
CY62157EV30LL-45BVXIT
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
71342LA20PFG8
Renesas Electronics' 71342LA20PFG8 is a 4Kx8 SRAM with 64 terminals, operating at 5V. It features an asynchronous mode, parallel interface, and common I/O type. Suitable for commercial applications requiring fast access times and low standby current.
IDT71V67603S133PFGI
Integrated Device Technology
CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; No. of Functions: 1;
DS1245Y-70
Dallas Semiconductor
NON-VOLATILE SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
5962-8855203YA
Defense Logistics Agency
Defense Logistics Agency's 5962-8855203YA is a MIL-STD-883 compliant SRAM chip with 32KX8 organization, operating at 5V. It features a ceramic, metal-sealed co-fired package in rectangular shape, suitable for military applications. With a memory density of 262144 bit and max access time of 55 ns, it offers reliable performance in harsh environments.
23LCV1024-I/ST
Microchip Technology
23LCV1024-I/ST by Microchip Technology is a 128KX8 SRAM with 20 MHz clock frequency, operating at -40 to 85 °C. It has separate I/O, 3-STATE output, and uses 0.65 mm terminal pitch. Ideal for industrial applications requiring high-speed synchronous memory in a small outline package.
5962-8685920YA
OTHER SRAM; Temperature Grade: MILITARY; No. of Terminals: 22; Package Code: DIP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
CY62167EV30LL-45ZXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
CY62128EV30LL-45ZXI
Infineon Technologies
Infineon's CY62128EV30LL-45ZXI is a 128Kx8 SRAM with 45ns access time, operating at 3V. It features asynchronous mode, common I/O type, and 3-state output characteristics. Ideal for industrial applications requiring fast memory access in a compact package.
71V124SA12YG8
The Renesas Electronics 71V124SA12YG8 is a 128Kx8 SRAM with 3.3V supply voltage, operating in asynchronous mode. It features a small outline package and offers fast access time of 12ns. Ideal for applications requiring high-speed data storage in commercial-grade environments.
5962-8685916LA
Austin Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-CDIP-T28;
AS6C62256-55PCN
Alliance Memory
Alliance Memory's AS6C62256-55PCN is a 32Kx8 SRAM with 55ns access time, operating at 3.3V. Ideal for commercial applications, it features a common I/O type and 3-state output characteristics in a rectangular package style.
CY7C1520KV18-250BZXI
Infineon's CY7C1520KV18-250BZXI is a 2MX36 DDR SRAM with 250 MHz clock frequency, operating at 1.8V. It features synchronous operation, 3-STATE output, and low profile grid array package. Ideal for industrial applications requiring fast access times and high memory density.
5962-8685904LA
Pyramid Semiconductor
OTHER SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Width: 7.62 mm;
CY62147EV30LL-45B2XIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Length: 8 mm;
CY62167G30-45BVXI
Infineon's CY62167G30-45BVXI is a 1MX16 SRAM with 45ns access time, operating at 3.6V. It features a very thin profile grid array package and offers 1048576 words of memory. Ideal for industrial applications requiring fast and reliable data storage with common I/O type and output enable functionality.
23LC512-I/SN
23LC512-I/SN by Microchip Technology is a 64KX8 SERIAL SRAM with 20 MHz fCLK, operating at -40 to 85 °C. It has 3-STATE output, SEPARATE I/O, and SYNCHRONOUS mode. Ideal for industrial applications requiring reliable memory storage in a compact SMALL OUTLINE package.
71V124SA12PHGI8
Renesas Electronics 71V124SA12PHGI8 is a 128Kx8 SRAM with 3.3V supply, operating at -40 to 85°C. It features asynchronous mode, common I/O type, and 12ns access time. Ideal for industrial applications requiring fast and reliable memory storage in a compact thin profile package.
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R1WV6416RBG-5SI#B0
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 67108864 bit;
R1WV6416RBG-5SI
STANDARD SRAM; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY; Maximum Operating Temperature: 85 Cel;
R1WV6416RBG-7SR
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Alternate Memory Width: 8;
R1WV6416RBG-7SR#B0
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
R1WV6416RBG-7SI#B0
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, FINE PITCH;
R1WV3216RSD-8SR
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: TSSOP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
R1WV3216RBG-8SR
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
R1WV6416RBG-5SR
STANDARD SRAM; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Organization: 4MX16; Maximum Operating Temperature: 70 Cel;
R1WV6416RBG-5SI#S0
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
R1WV3216RSD-7SI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP52,.4,16;
R1WV6416RBG-7SI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Alternate Memory Width: 8;
R1WV6416RBG-5SR#B0
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Technology: CMOS;
R1WV3216RSD-8SI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
R1WV6416RBG-7SI#S0
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
R1WV3216RBG-8SI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Current: 70 mA;
R1WV3216RBG-7SI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 20;
R1WV3216RBG-7SR#B0
STANDARD SRAM; Moisture Sensitivity Level (MSL): 3;
R1WV3216RSD-7SR
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
R1WV6416RBG-5SR#S0
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; No. of Words: 4194304 words;
R1WV3216RBG-8SW
STANDARD SRAM; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Pitch: .75 mm;
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