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HS9-6664RH-8

Renesas Electronics

HS9-6664RH-8 by Renesas Electronics

OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DFP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;

Median Price

-

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Supply Digital

USA . 2,211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,211

-

-

-

-

Technical Specifications

OTP ROM HS9-6664RH-8 attributes and parameters. Explore more OTP ROM devices from Renesas Electronics

Specs

JESD-30 Code:

R-CDFP-F28

JESD-609 Code:

e4

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX8

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class Q

Maximum Seated Height:

2.92 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

GOLD

Terminal Form:

FLAT

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

12.445 mm

Trade Compliance

HS9-6664RH-8 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Renesas Electronics

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