Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
FIFOs;
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< 1k
Vyrian
1+ parts
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Native Components
$1.061
Northwest PG Solutions
$1.167
7208L15PDGI Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
M39029/58-360
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
BAV99
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
Zetex Plc
LL4148
Semtech Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
LM107H/883
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
SS14
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Panjit International
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Sensitron Semiconductor
LP2950CDT-3.3G
LP2950CDT-3.3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in electronic circuits.
1N4148WS
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ABS06-32.768KHZ-T
Abracon
Abracon's ABS06-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 90000 ohm series resistance, and -40 to 85 °C operating temperature range. Ideal for applications requiring precise timing in compact designs like IoT devices and wearables.
SN74ACT7813-15DL
SN74ACT7813-15DL by Texas Instruments is a 64x18 FIFO with 15ns cycle time, operating at 5V. It features synchronous operation, 67MHz clock frequency, and 1152-bit memory density. Ideal for applications requiring fast data transfer in commercial-grade environments.
SN74ACT2229DW
SN74ACT2229DW by Texas Instruments is a FIFO memory with 256x1 organization, operating at 60 MHz clock frequency. It features a cycle time of 16.67 ns and operates in synchronous mode. This small outline package is ideal for industrial applications requiring fast access times and low standby current consumption.
SN74ACT2235-60PAGR
SN74ACT2235-60PAGR by Texas Instruments is a FIFO with 1KX9 organization, 60 ns cycle time, and 70°C max operating temp. It is used in applications requiring fast data storage and retrieval, such as communication systems and industrial automation.
SN74ACT7202LA-50NP
SN74ACT7202LA-50NP by Texas Instruments is a FIFO with 1Kx9 organization, 65ns cycle time, and 15MHz clock frequency. It operates asynchronously and has a memory density of 9216 bits. Ideal for applications requiring fast data storage and retrieval in parallel processing systems.
72V2111L15PFGI
Integrated Device Technology
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 524288 words;
7203L15JI8
7203L15JI8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can handle a max supply voltage of 5.5V. Ideal for industrial applications requiring fast data storage and retrieval in parallel mode.
SN74ACT7203L-25DV
SN74ACT7203L-25DV by Texas Instruments is a FIFO with 2KX9 organization, 35 ns cycle time, and 28.5 MHz clock frequency. It operates at 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT3631-30PQR
SN74ACT3631-30PQR by Texas Instruments is a FIFO with 512x36 organization, 30 ns cycle time, and 15 ns max access time. It operates synchronously at 5V and has a memory density of 18432 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT2235-20FN
SN74ACT2235-20FN by Texas Instruments is a FIFO chip with 1KX9 organization, operating at 20 ns cycle time and 50 MHz clock frequency. It is used in applications requiring bi-directional memory access, such as data buffering and caching in parallel systems.
SN74ACT72231L-25RJ
SN74ACT72231L-25RJ by Texas Instruments is a FIFO chip with 2Kx9 organization, operating at 25ns cycle time and 40MHz clock frequency. It is used in applications requiring synchronous operation, such as data buffering and communication systems.
SN74ACT3622-15PQ
SN74ACT3622-15PQ by Texas Instruments is a FIFO with 256x36 organization, operating at 66.7MHz cycle time of 15ns. It has a memory density of 9216 bit and is ideal for applications requiring fast synchronous data transfer in commercial temperature grades.
SN54ABT3614PCB
SN54ABT3614PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, operating at 50 MHz clock frequency. It features a 20 ns cycle time, synchronous operation, and 3-STATE output characteristics. Ideal for military applications due to its -55 to 125 °C temperature range and low profile flatpack package style.
5962-9562701QYA
The Texas Instruments 5962-9562701QYA is a MILITARY-grade FIFO memory IC with 1KX18 organization, operating at up to 50 MHz clock frequency. It features SYNCHRONOUS operation, 0.635 mm terminal pitch, and a max standby current of 0.0012 Amp. Ideal for high-reliability applications in harsh environments requiring fast data access.
SN74ACT3631-30PCB
SN74ACT3631-30PCB by Texas Instruments is a FIFO with 512x36 organization, 30 ns cycle time, and 33.4 MHz max clock frequency. It operates synchronously at 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V801L15PFGI8
Renesas Electronics
The Renesas Electronics 72V801L15PFGI8 is a FIFO with 256x9 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It is suitable for industrial applications requiring a memory density of 2304 bit, such as data buffering in communication systems or signal processing equipment.
SN74ACT3642-30PCB
SN74ACT3642-30PCB by Texas Instruments is a FIFO memory IC with 1Kx36 organization, 30 ns cycle time, and 33.4 MHz clock frequency. It operates at 5V, has a memory density of 36864 bits, and is used in applications requiring fast synchronous data storage and retrieval.
CD40105B
CD40105B by Texas Instruments is a 16x4 FIFO chip operating asynchronously at 5V, with a memory width of 4 bits and memory density of 64 bits. It features output enable functionality, has a max access time of 420ns, and is suitable for military-grade applications due to its temperature range from -55°C to 125°C.
7202LA25J8
7202LA25J8 by Integrated Device Technology is a FIFO memory chip with a cycle time of 35 ns and an operating voltage of 5V. It is commonly used in applications that require high-speed data buffering and storage, such as telecommunications and networking systems.
SN74ACT3632-30PQ
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Terminal Form: GULL WING;
SN74ABT7820-20PH
SN74ABT7820-20PH by Texas Instruments is a FIFO with 512x18 organization, operating at 20 ns cycle time and 50 MHz clock frequency. It is ideal for applications requiring fast synchronous data transfer in commercial temperature environments.
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7208L20JG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Density: 589824 bit;
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
7208L20PDGG8
BI-DIRECTIONAL FIFO;
7208L15JG8
BI-DIRECTIONAL FIFO; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Organization: 64KX9; Maximum Supply Current: 120 mA;
7208L20PDGGB
7208L20PDG
BI-DIRECTIONAL FIFO; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .012 Amp; Maximum Clock Frequency (fCLK): 33.3 MHz;
7208L12JG8
FIFOs; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 3;
7208L15JGI
FIFOs; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3;
7208L20JG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Surface Mount: YES;
7208L20JGB
7208L20JGI8
7208L15PDG
BI-DIRECTIONAL FIFO; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 64K; Output Characteristics: 3-STATE;
7208L20PDGG
7208L15JG
BI-DIRECTIONAL FIFO; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .012 Amp; Terminal Pitch: 1.27 mm;
7208L20JGB8
7208L12JG
FIFOs; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Matte Tin (Sn) - annealed; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3;
7208L12PDG
7208L15JGI8
FIFOs; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Matte Tin (Sn) - annealed; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3;
7208L20JGI
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