Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIFOs; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 3;
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FIFO 7208L12JG8 attributes and parameters. Explore more FIFO devices from Renesas Electronics
JESD-609 Code:
Moisture Sensitivity Level (MSL):
Peak Reflow Temperature (C):
Terminal Finish:
Maximum Time At Peak Reflow Temperature (s):
7208L12JG8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
BAV99
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
LL4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBR1560CT
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
SS14
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
Leshan Radio
2N2222A
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
Goodwork Semiconductor
72V2105L10PFG
Integrated Device Technology
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
SN74ACT2235-40PM
Texas Instruments
SN74ACT2235-40PM by Texas Instruments is a FIFO memory with 1Kx9 organization, operating at 40ns cycle time and 25MHz clock frequency. It features a 64-terminal flatpack package suitable for commercial applications requiring bi-directional FIFO memory with 3-state output characteristics.
1M7881-20PNG4
1M7881-20PNG4 by Texas Instruments is a 1Kx18 FIFO with 20ns cycle time, operating at 5V. It features synchronous mode, parallel interface, and GULL WING terminals. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT72V05L25JI8
IDT72V05L25JI8 by Integrated Device Technology is a FIFO chip with 8Kx9 organization, operating at 3.3V. It features a cycle time of 35ns and max clock frequency of 28.5MHz, suitable for industrial applications requiring fast data storage and retrieval in parallel mode.
IDT7203L15J8
IDT7203L15J8 by Integrated Device Technology is a 2Kx9 FIFO chip with 25ns cycle time, operating at 5V. It features 40MHz clock frequency and 3-STATE output, suitable for commercial applications requiring fast data buffering and retrieval. The chip comes in a rectangular plastic/epoxy package with J BEND terminals, making it ideal for surface mount PCB designs.
SN74ACT7206L-15RJR
SN74ACT7206L-15RJR by Texas Instruments is a 16Kx9 FIFO chip with 25ns cycle time, operating at 5V. It features 3-STATE output characteristics and operates in parallel mode. This CMOS technology chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7200L20DV
SN74ACT7200L20DV by Texas Instruments is a FIFO chip with 256x9 organization, operating in asynchronous mode at 5V. It features a memory density of 2304 bits and operates in parallel mode. This CMOS technology device is ideal for applications requiring high-speed data storage and retrieval.
CD74HCT40105MT
CD74HCT40105MT by Texas Instruments is a FIFO memory IC with 16x4 organization, operating at 5V. It has a cycle time of 100ns and max clock frequency of 10MHz. Ideal for military applications requiring synchronous operation and parallel data transfer.
SN74ABT3611-20PCB
SN74ABT3611-20PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 20ns cycle time, and 50MHz clock frequency. It operates synchronously at 5V, has a low profile flatpack package style, and is ideal for parallel data storage applications.
IDT72V215L15TFGI
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE; No. of Words Code: 512;
IDT7200L25JI8
IDT7200L25JI8 by Integrated Device Technology is a FIFO chip with 256x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is used in industrial applications requiring fast asynchronous data storage and retrieval capabilities.
72V211L10PFG8
Renesas Electronics
The Renesas Electronics 72V211L10PFG8 FIFO operates in synchronous mode with a cycle time of 10 ns and a clock frequency of up to 100 MHz. It has an organization of 512x9, suitable for applications requiring fast data processing such as networking equipment and telecommunications devices.
SN74ACT7205L-50DV
SN74ACT7205L-50DV by Texas Instruments is a FIFO memory with 8Kx9 organization, 65ns cycle time, and 15MHz clock frequency. It operates at 5V, has a small outline package style, and is suitable for applications requiring fast data storage and retrieval in commercial temperature environments.
72V36100L10PF
72V36100L10PF FIFO by Integrated Device Technology features a cycle time of 10 ns, operating at 100 MHz clock frequency. With an organization of 64KX36, it is ideal for applications requiring fast data processing and storage in commercial temperature environments. The FIFO supports synchronous operation with a supply voltage of 3.3 V, making it suitable for various parallel data transfer tasks.
IDT7203L15PI
IDT7203L15PI by Integrated Device Technology is a FIFO memory chip with 2Kx9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can function in industrial temperature ranges. This chip is suitable for applications requiring fast data storage and retrieval in parallel processing systems.
72V221L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Length: 7 mm;
SN74ACT72221L-20RJ
SN74ACT72221L-20RJ by Texas Instruments is a FIFO chip with 1KX9 organization, 20 ns cycle time, and 50 MHz clock frequency. It operates synchronously at 5V and has a memory density of 9216 bit. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
5962-9560801NXX
Texas Instruments' 5962-9560801NXX FIFO operates synchronously with a cycle time of 20ns and clock frequency up to 50MHz. Ideal for military applications, it features a memory density of 36864 bits, operating temperature range from -55 to 125°C, and low profile flatpack packaging.
SN74V263PZAEP
SN74V263PZAEP by Texas Instruments is a FIFO memory with 8Kx18 organization, operating at 133 MHz. It features a cycle time of 7.5 ns and synchronous operation, suitable for military-grade applications requiring fast data processing and low power consumption. With a package style of flatpack and low profile design, it offers high memory density of 147456 bits in a compact form factor.
SN74ACT2235-60PAG
SN74ACT2235-60PAG by Texas Instruments is a FIFO memory IC with 1Kx9 organization, operating at 60 ns cycle time and 16.7 MHz clock frequency. It features a 64-terminal flatpack package suitable for commercial temperature grades. Ideal for applications requiring bi-directional parallel memory with output enable functionality.
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7208L20JG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Density: 589824 bit;
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
7208L20PDGG8
BI-DIRECTIONAL FIFO;
7208L15JG8
BI-DIRECTIONAL FIFO; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Organization: 64KX9; Maximum Supply Current: 120 mA;
7208L20PDGGB
7208L20PDG
BI-DIRECTIONAL FIFO; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .012 Amp; Maximum Clock Frequency (fCLK): 33.3 MHz;
7208L15PDGI
FIFOs;
7208L15JGI
FIFOs; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3;
7208L20JG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Surface Mount: YES;
7208L20JGB
7208L20JGI8
7208L15PDG
BI-DIRECTIONAL FIFO; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 64K; Output Characteristics: 3-STATE;
7208L20PDGG
7208L15JG
BI-DIRECTIONAL FIFO; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .012 Amp; Terminal Pitch: 1.27 mm;
7208L20JGB8
7208L12JG
FIFOs; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Matte Tin (Sn) - annealed; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3;
7208L12PDG
7208L15JGI8
FIFOs; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Matte Tin (Sn) - annealed; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3;
7208L20JGI
7208L12JG8
FIFOs; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
Supply Digital Components
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