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SZHBL5006XV2T5G

Onsemi

SZHBL5006XV2T5G by Onsemi

SZHBL5006XV2T5G by Onsemi is a silicon surge protector with a max breakdown voltage of 8V and on-state voltage of 1.3V. It has a trigger device type configuration, suitable for applications requiring protection against electrical surges in automotive electronics. Operating temperature ranges from -40 °C to 150°C, making it ideal for harsh environments.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 819,000 parts In-Stock

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Flip Electronics

USA . 819,000 parts In-Stock

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Vyrian

USA . 6,564 parts In-Stock

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Digiode

USA . 789 parts In-Stock

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AZTECH Wire

Italy . 743 parts In-Stock

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$15.840

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Kulean Microsystems

USA . 6,530 parts In-Stock

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TANS Electronics

Latvia . 4,909 parts In-Stock

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SupplyDigital Components

Austria . 4,838 parts In-Stock

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Problanco Electronics

Mexico . 1,938 parts In-Stock

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Corphita

USA . 1,395 parts In-Stock

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UHIMA Technologies

Türkiye . 748 parts In-Stock

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Corohmni

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Overview

Discover the cutting-edge technology of the SZHBL5006XV2T5G by Onsemi, a top-tier manufacturer known for delivering high-quality Silicon Surge Protectors. Designed to provide unparalleled protection against voltage surges, this product is a game-changer in its category. With a sleek rectangular package shape and dual terminals, it offers easy installation and maximum efficiency. Perfect for a wide range of applications, this Silicon Surge Protector guarantees peace of mind and reliability. Don't settle for subpar protection - choose the SZHBL5006XV2T5G for superior performance and unmatched value.

Feature Benefit Bullets

Maximum On-state Voltage: 1.3 V

Low maximum on-state voltage helps protect against high voltage spikes, making this surge protector efficient in safeguarding electronic devices.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and reliability in various environmental conditions.

Configuration: SINGLE

Single configuration makes installation and operation simpler and more straightforward.

Surface Mount: YES

Being surface mountable enables easy and convenient integration onto circuit boards.

Minimum Breakdown Voltage: 6.5 V

Having a minimum breakdown voltage of 6.5 V ensures protection against voltage surges that could potentially harm connected devices.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB and ease of placement during assembly.

Terminal Form: FLAT

Flat terminal form facilitates secure and stable connection to the circuit board.

No. of Terminals: 2

Having 2 terminals simplifies the connection process and ensures proper functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for denser circuit designs.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150 °C ensures reliability even in harsh operating conditions.

Trigger Device Type: SILICON SURGE PROTECTOR

The use of silicon surge protector as the trigger device ensures effective and fast response to voltage spikes, protecting connected devices.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C ensures functionality even in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal position enables flexibility in PCB layout and installation, catering to different design requirements.

Maximum Holding Current: 40 mA

High maximum holding current of 40 mA ensures the surge protector can handle transient currents without damage.

Maximum Breakdown Voltage: 8 V

Having a maximum breakdown voltage of 8 V provides an extra margin of safety against voltage surges, protecting connected devices effectively.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this surge protector can withstand reflow soldering processes without degradation.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C ensures proper soldering and assembly of the surge protector onto the PCB.

Reference Standard: AEC-Q101; IEC-61000-4-2; ISO 10605

Compliance with industry standards such as AEC-Q101, IEC-61000-4-2, and ISO 10605 guarantees the quality and performance of the surge protector.

Technical Specifications

Silicon Surge Protectors SZHBL5006XV2T5G attributes and parameters. Explore more Silicon Surge Protectors devices from Onsemi

Specs

Additional Features:

HIGH RELIABILITY

Maximum Breakdown Voltage:

8 V

Minimum Breakdown Voltage:

6.5 V

Configuration:

Maximum Holding Current:

40 mA

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum On-state Voltage:

1.3 V

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Reference Standard:

AEC-Q101; IEC-61000-4-2; ISO 10605

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

SZHBL5006XV2T5G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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