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STK350-040

Onsemi

STK350-040 by Onsemi

STK350-040 by Onsemi is a 15-terminal hybrid audio amplifier IC. It features 2 functions, with a terminal pitch of 2.54mm. Ideal for audio and video amplification applications due to its high-quality performance and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,660 parts In-Stock

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1,660

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Digiode

USA . 595 parts In-Stock

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595

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,027 parts In-Stock

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7,027

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SupplyDigital Components

Austria . 3,936 parts In-Stock

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3,936

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Kulean Microsystems

USA . 2,457 parts In-Stock

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2,457

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TANS Electronics

Latvia . 894 parts In-Stock

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894

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Corphita

USA . 687 parts In-Stock

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687

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Corohmni

South Africa . 256 parts In-Stock

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256

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UHIMA Technologies

Türkiye . 233 parts In-Stock

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Overview

Enhance your audio experience with the Onsemi STK350-040 Audio Amplifier. Crafted by a reputable manufacturer, this hybrid technology amplifier offers exceptional quality and reliability. Perfect for a wide range of applications in the audio and video industry, this amplifier boasts two functions and 15 terminals for seamless integration. Elevate your sound system with the STK350-040 and enjoy crystal-clear audio performance like never before. Upgrade your setup today and immerse yourself in an unparalleled audio experience.

Feature Benefit Bullets

No. of Functions: 2

Having multiple functions allows for flexibility and versatility in use, making this audio amplifier suitable for a variety of applications.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound output and optimal performance for audio applications.

No. of Terminals: 15

Having a larger number of terminals provides more connection options, allowing for greater customization and compatibility with various setups.

Terminal Position: SINGLE

The single terminal position simplifies the installation process and reduces potential confusion, making it user-friendly for consumers.

Technology: HYBRID

Hybrid technology combines different types of circuitry for improved performance and efficiency, resulting in better overall audio amplification.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm makes it easier to connect and integrate into existing systems, ensuring compatibility and ease of use.

Technical Specifications

Audio & Video Amplifiers STK350-040 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

2

No. of Terminals:

15

Package Equivalence Code:

SIP15,.1

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

NO

Technology:

HYBRID

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STK350-040 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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