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STK3102III

Onsemi

STK3102III by Onsemi

STK3102III by Onsemi is a 15-terminal hybrid audio amplifier IC. It features 2 functions, with a terminal pitch of 2.54mm. Ideal for audio and video amplification applications.

Median Price

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Lifecycle Status

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6

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1k+

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Vyrian

USA . 1,032 parts In-Stock

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Digiode

USA . 259 parts In-Stock

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Electronic Expediters

USA . 9 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 8 parts In-Stock

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Huijzer Components

Netherlands . 2 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 2 parts In-Stock

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Problanco Electronics

Mexico . 5,434 parts In-Stock

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Kulean Microsystems

USA . 4,892 parts In-Stock

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TANS Electronics

Latvia . 4,280 parts In-Stock

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SupplyDigital Components

Austria . 4,119 parts In-Stock

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Corphita

USA . 542 parts In-Stock

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UHIMA Technologies

Türkiye . 398 parts In-Stock

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Corohmni

South Africa . 343 parts In-Stock

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Overview

Unleash the power of superior audio amplification with the STK3102III by Onsemi. Crafted with precision and expertise, this hybrid technology amplifier offers unrivaled quality and performance in the realm of audio and video amplifiers. With its dual functions and easy single terminal positioning, this amplifier is perfect for a wide range of applications. Elevate your audio experience and enjoy crystal-clear sound with the STK3102III. Experience the value and benefits that only Onsemi can deliver.

Feature Benefit Bullets

No. of Functions: 2

Having 2 functions allows for more versatility and capabilities in the amplifier, making it suitable for a wider range of audio applications.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high performance and quality output for audio signals, making it ideal for audio applications.

No. of Terminals: 15

With 15 terminals, this amplifier can accommodate multiple input and output connections, providing flexibility in connecting various audio sources and speakers.

Terminal Position: SINGLE

The single terminal position simplifies the installation process and ensures a straightforward connection setup, making it user-friendly and easy to use.

Technology: HYBRID

The hybrid technology used in this amplifier combines the benefits of different technologies, offering improved performance, efficiency, and reliability compared to single technology solutions.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for a compact design while still providing sufficient space for easy and secure terminal connections, contributing to the overall efficiency and usability of the amplifier.

Technical Specifications

Audio & Video Amplifiers STK3102III attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

2

No. of Terminals:

15

Package Equivalence Code:

SIP15,.1

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

NO

Technology:

HYBRID

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STK3102III General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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