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STK3122III

Onsemi

STK3122III by Onsemi

STK3122III by Onsemi is a 15-terminal hybrid audio amplifier IC with 2 functions. It has a terminal pitch of 2.54 mm and is ideal for audio and video amplification applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,761 parts In-Stock

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1,761

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Digiode

USA . 1,410 parts In-Stock

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1,410

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Electronic Expediters

USA . 19 parts In-Stock

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19

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Huijzer Components

Netherlands . 1 parts In-Stock

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1

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Distributors (Availability)

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SupplyDigital Components

Austria . 7,877 parts In-Stock

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7,877

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Problanco Electronics

Mexico . 7,261 parts In-Stock

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7,261

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Kulean Microsystems

USA . 6,599 parts In-Stock

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6,599

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TANS Electronics

Latvia . 2,900 parts In-Stock

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2,900

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Corphita

USA . 748 parts In-Stock

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748

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UHIMA Technologies

Türkiye . 571 parts In-Stock

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571

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Corohmni

South Africa . 439 parts In-Stock

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439

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Overview

Unleash the power of crystal-clear audio with the STK3122III by Onsemi. Manufactured to perfection, this audio amplifier is designed to deliver exceptional sound quality and performance. Perfect for a wide range of applications in the audio and video industry, this product offers unbeatable value and benefits to our customers. Elevate your listening experience with the STK3122III and enjoy the advantages of Onsemi's top-notch technology and reliability.

Feature Benefit Bullets

No. of Functions: 2

Having 2 functions means this audio amplifier can handle multiple inputs or outputs simultaneously, providing flexibility in its usage.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound output with minimal distortion, making it ideal for audio applications.

No. of Terminals: 15

With 15 terminals, this amplifier offers ample connectivity options for various components, enabling versatile set-ups and configurations.

Terminal Position: SINGLE

A single terminal position simplifies installation and wiring processes, making it user-friendly and efficient.

Technology: HYBRID

The hybrid technology used in this amplifier combines different technologies to deliver superior performance, such as enhanced efficiency and reliability.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch provides compatibility with standard connectors and accessories, ensuring ease of integration and compatibility with existing equipment.

Technical Specifications

Audio & Video Amplifiers STK3122III attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

2

No. of Terminals:

15

Package Equivalence Code:

SIP15,.1

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

NO

Technology:

HYBRID

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STK3122III General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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