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STK3152III

Onsemi

STK3152III by Onsemi

STK3152III by Onsemi is a 15-terminal hybrid audio amplifier IC. It offers 2 functions and features a terminal pitch of 2.54 mm. Ideal for audio and video amplification applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,286 parts In-Stock

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2,286

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Vyrian

USA . 571 parts In-Stock

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571

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Fibra_Brandt Electronic GMBH

Germany . 78 parts In-Stock

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78

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GES GmbH

Germany . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 6,849 parts In-Stock

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6,849

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Kulean Microsystems

USA . 4,675 parts In-Stock

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4,675

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Problanco Electronics

Mexico . 4,494 parts In-Stock

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4,494

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SupplyDigital Components

Austria . 2,373 parts In-Stock

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2,373

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Corphita

USA . 511 parts In-Stock

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511

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UHIMA Technologies

Türkiye . 460 parts In-Stock

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460

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Corohmni

South Africa . 251 parts In-Stock

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251

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Overview

Enhance your audio experience with the STK3152III by Onsemi, a top-notch audio amplifier designed to deliver superior sound quality. Manufactured by Onsemi, a reputable industry leader known for their innovative technology and reliable products, this amplifier is perfect for a wide range of audio and video applications. With its advanced features and high-performance capabilities, the STK3152III offers customers unmatched value, benefits, and advantages, making it the ideal choice for all your audio amplification needs. Elevate your audio experience today with the STK3152III.

Feature Benefit Bullets

No. of Functions: 2

Having 2 functions in one device provides versatility and flexibility in audio amplification, allowing for different settings and configurations.

General IC Type: AUDIO AMPLIFIER

Being specifically designed for audio amplification ensures high-quality sound output and performance in this product.

No. of Terminals: 15

Having 15 terminals enables proper connections and compatibility with various audio devices and setups, making it a versatile option.

Terminal Position: SINGLE

Single terminal position simplifies the installation and setup process, making it user-friendly and less prone to errors.

Technology: HYBRID

The hybrid technology used in this product combines the benefits of different types of amplifiers, resulting in improved efficiency and performance.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy and precise connections, ensuring stable audio output and reducing the risk of signal interference.

Technical Specifications

Audio & Video Amplifiers STK3152III attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

2

No. of Terminals:

15

Package Equivalence Code:

SIP15,.1

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

NO

Technology:

HYBRID

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STK3152III General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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