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STK3082III

Onsemi

STK3082III by Onsemi

STK3082III by Onsemi is an audio amplifier IC with 2 functions, 15 terminals, and hybrid technology. It has a terminal pitch of 2.54 mm. Ideal for audio and video amplification applications due to its high-quality performance and compact design.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 1,808 parts In-Stock

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Digiode

USA . 101 parts In-Stock

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Huijzer Components

Netherlands . 20 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 19 parts In-Stock

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Electronic Expediters

USA . 15 parts In-Stock

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LittleDiode

UK . 3 parts In-Stock

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SupplyDigital Components

Austria . 7,571 parts In-Stock

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TANS Electronics

Latvia . 3,758 parts In-Stock

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Corphita

USA . 1,834 parts In-Stock

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UHIMA Technologies

Türkiye . 668 parts In-Stock

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Problanco Electronics

Mexico . 500 parts In-Stock

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Corohmni

South Africa . 87 parts In-Stock

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Kulean Microsystems

USA . 67 parts In-Stock

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Elevate your audio experience with the STK3082III by Onsemi. Known for their top-notch quality and expertise in producing cutting-edge technology, Onsemi brings you a powerful audio amplifier that delivers exceptional sound performance. Whether you're a music enthusiast, audiophile, or professional in need of high-quality amplification, this product is designed to meet your needs. With its sleek design, easy installation, and reliable performance, the STK3082III is the perfect choice for enhancing your audio and video systems. Upgrade your sound system today and immerse yourself in crystal-clear, dynamic sound like never before.

Feature Benefit Bullets

No. of Functions: 2

Having 2 functions allows for versatility and flexibility in use, making this audio amplifier suitable for a variety of applications.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound output and performance, making it a reliable choice for audio amplification needs.

No. of Terminals: 15

The higher number of terminals enables easy connectivity with various audio devices, providing more options for integration and setup.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and reduces the chances of wiring errors, ensuring seamless connectivity and operation.

Technology: HYBRID

The hybrid technology used in this amplifier combines the advantages of different technologies, resulting in improved performance, efficiency, and reliability.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for precise and secure connections, minimizing the risk of signal interference or loss and ensuring stable audio output.

Technical Specifications

Audio & Video Amplifiers STK3082III attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

2

No. of Terminals:

15

Package Equivalence Code:

SIP15,.1

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

NO

Technology:

HYBRID

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STK3082III General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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