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SLP167B90

Onsemi

SLP167B90 by Onsemi

SLP167B90 by Onsemi is a red LED array with 5 LEDs, emitting at peak wavelength of 700nm. It operates b/w -25 °C to 80°C, with max forward voltage of 2.4V and min luminous intensity of 0.00011cd. Ideal for applications requiring low-power consumption and precise red light emission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,423 parts In-Stock

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2,423

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Digiode

USA . 1,959 parts In-Stock

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1,959

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,482 parts In-Stock

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7,482

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SupplyDigital Components

Austria . 6,287 parts In-Stock

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6,287

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Problanco Electronics

Mexico . 5,196 parts In-Stock

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5,196

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Corphita

USA . 2,450 parts In-Stock

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2,450

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TANS Electronics

Latvia . 1,791 parts In-Stock

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1,791

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UHIMA Technologies

Türkiye . 639 parts In-Stock

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639

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Corohmni

South Africa . 148 parts In-Stock

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148

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Overview

Illuminate your world with the SLP167B90 by Onsemi, a top-of-the-line optoelectronics solution that promises exceptional quality and performance. With its peak wavelength of 700nm and vibrant red color, this product is perfect for a wide range of applications. Whether you're looking to enhance your signage, create eye-catching displays, or improve visibility in low-light conditions, the SLP167B90 delivers unmatched value, benefits, and advantages. Trust Onsemi's reputation for excellence and experience the difference with this innovative product today.

Feature Benefit Bullets

Peak Wavelength (nm): 700

This specific peak wavelength of 700nm ensures that the light emitted by the product is in the red spectrum, making it ideal for applications requiring red light.

Maximum Operating Temperature: 80 °C

The high maximum operating temperature of 80 °C allows this product to be used in a wide range of environments without the risk of overheating.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25 °C means that this product can still function effectively in cold conditions, providing versatility in its usage.

Minimum Luminous Intensity: 0.00011 cd

The minimum luminous intensity of 0.00011 cd ensures that the product emits a sufficient amount of light, making it suitable for various lighting applications.

Color At Wavelength: Red

The color of the light emitted by this product being red can be advantageous for specific signaling or visual identification purposes in different scenarios.

No. of LEDs in Array: 5

The product having 5 LEDs in the array increases the overall brightness and coverage of the emitted light, making it a reliable source of illumination.

Maximum Forward Voltage: 2.4 V

The maximum forward voltage of 2.4V ensures efficient power usage and allows compatibility with different power sources, contributing to the product's overall reliability.

Technical Specifications

Other Function Optoelectronics SLP167B90 attributes and parameters. Explore more Other Function Optoelectronics devices from Onsemi

Specs

Color At Wavelength:

Red

Maximum Forward Voltage:

2.4 V

Minimum Luminous Intensity:

.00011 cd

No. of LEDs in Array:

5

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Peak Wavelength (nm):

700

Sub-Category:

Other Optoelectronics

Trade Compliance

SLP167B90 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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