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SLP156B51

Onsemi

SLP156B51 by Onsemi

SLP156B51 by Onsemi is a red diffused lens optoelectronic component with peak wavelength of 700nm. It operates b/w -25 °C to 80°C, with max forward voltage of 2.4V. Ideal for applications requiring precise red light emission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,246 parts In-Stock

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1,246

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Vyrian

USA . 174 parts In-Stock

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174

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TANS Electronics

Latvia . 8,017 parts In-Stock

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8,017

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SupplyDigital Components

Austria . 7,959 parts In-Stock

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7,959

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Kulean Microsystems

USA . 7,729 parts In-Stock

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7,729

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Problanco Electronics

Mexico . 5,969 parts In-Stock

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Corphita

USA . 1,890 parts In-Stock

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1,890

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UHIMA Technologies

Türkiye . 671 parts In-Stock

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671

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Corohmni

South Africa . 265 parts In-Stock

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Overview

Experience the superior quality and reliability of the SLP156B51 by Onsemi. With a peak wavelength of 700nm and diffused lens type, this optoelectronic marvel is designed to deliver exceptional performance in a wide range of applications. Whether you need precise color indication or reliable signal transmission, this product offers unmatched value and benefits. Trust in Onsemi's reputation for excellence and elevate your projects with the SLP156B51.

Feature Benefit Bullets

Peak Wavelength (nm): 700

The peak wavelength of 700nm indicates that this product emits light in the red spectrum, which can be useful for applications requiring red light output.

Lens Type: DIFFUSED

The diffused lens type helps in dispersing the light evenly, making it suitable for applications where uniform illumination is desired.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature of 80 °C, this product can withstand elevated temperatures, making it suitable for use in various environments.

Height: 8 mm

The compact height of 8mm makes this product suitable for space-constrained applications where size matters.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25 °C ensures that this product can function efficiently even in cold environments.

Color At Wavelength: Red

The red color output at the specified wavelength adds versatility to this product, allowing it to be used in applications requiring red light.

Maximum Forward Voltage: 2.4 V

The low maximum forward voltage of 2.4 V ensures energy efficiency and helps in reducing power consumption, making this product a cost-effective choice.

Technical Specifications

Other Function Optoelectronics SLP156B51 attributes and parameters. Explore more Other Function Optoelectronics devices from Onsemi

Specs

Color At Wavelength:

Red

Maximum Forward Voltage:

2.4 V

Lens Type:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Height:

8 mm

Peak Wavelength (nm):

700

Sub-Category:

Visible LEDs

Trade Compliance

SLP156B51 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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