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SGP23N60UFTU

Onsemi

SGP23N60UFTU by Onsemi

SGP23N60UFTU by Onsemi is an N-CHANNEL IGBT transistor with 600V max collector-emitter voltage, 23A max collector current, and 100W max power dissipation. Ideal for motor control applications due to its fast turn-off time of 320ns and high operating temperature of 150 °C.

Median Price

$1.715

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 1,262 parts In-Stock

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$1.480

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$1.330

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$1.250

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$1.480

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$1.250

Verical

USA . 1,075 parts In-Stock

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$1.950

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Flip Electronics (Authorized)

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Digiode

USA . 1,528 parts In-Stock

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$1.568

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Vyrian

USA . 1,969 parts In-Stock

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$1.650

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Chip Stock

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Flip Electronics

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ComSIT Distribution GmbH

Germany . 7 parts In-Stock

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ComSIT USA

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Corphita

USA . 416 parts In-Stock

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$1.485

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416

$1.485

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Corohmni

South Africa . 50 parts In-Stock

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$1.650

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Andel Nordic

Denmark . 3,372 parts In-Stock

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$1.840

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$1.286

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$1.286

3,372

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$1.286

RC Electronics

USA . 31,720 parts In-Stock

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$1.790

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$1.640

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$1.590

31,720

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$1.590

Kulean Microsystems

USA . 5,556 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 3,265 parts In-Stock

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TANS Electronics

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Problanco Electronics

Mexico . 2,861 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Perfect Parts

USA . 1,529 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 979 parts In-Stock

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Microchip USA

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Assy Fe

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Overview

Enhance your motor control applications with the SGP23N60UFTU by Onsemi, a high-quality N-channel Insulated Gate Bipolar Transistor. Manufactured by Onsemi, known for their reliable and durable components, this IGBT offers a maximum collector-emitter voltage of 600V and a maximum collector current of 23A, ensuring optimal performance. With a fast fall time of 280ns and a nominal turn off time of 320ns, this transistor provides efficient power dissipation of up to 100W. Upgrade your projects with the SGP23N60UFTU and experience enhanced control and reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, making it a reliable choice for controlling motors efficiently.

Maximum Fall Time (tf): 280 ns

Fast fall time allows for quick switching speeds, making it suitable for high-frequency applications.

Maximum Power Dissipation (Abs): 100 W

Capable of handling high power dissipation, providing robust performance in demanding situations.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, ideal for industrial or high-temperature environments.

Maximum Collector-Emitter Voltage: 600 V

Capable of handling high voltage levels, suitable for applications requiring high voltage switching.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SGP23N60UFTU attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS, HIGH SPEED SWITCHING

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

280 ns

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

320 ns

Nominal Turn On Time (ton):

55 ns

Trade Compliance

SGP23N60UFTU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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