Loading...

SC511663MVR40R

Onsemi

SC511663MVR40R by Onsemi

SC511663MVR40R by Onsemi is a 32-bit microcontroller with 24-bit address bus width and 32-bit external data bus width. It operates at a max clock frequency of 20 MHz, suitable for applications requiring high-speed processing. With features like PWM channels and ADC channels, it is ideal for use in various embedded systems that demand efficient control and data acquisition capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,562 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,562

-

-

-

-

Digiode

USA . 772 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

772

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 916 parts In-Stock

1+ parts

$31.000

100+ parts

-

1k+ parts

-

10k+ parts

-

916

$31.000

-

-

-

SupplyDigital Components

Austria . 7,932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,932

-

-

-

-

TANS Electronics

Latvia . 7,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,692

-

-

-

-

Problanco Electronics

Mexico . 6,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,729

-

-

-

-

Kulean Microsystems

USA . 3,794 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,794

-

-

-

-

Corphita

USA . 807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

807

-

-

-

-

UHIMA Technologies

Türkiye . 783 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

783

-

-

-

-

Corohmni

South Africa . 53 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

53

-

-

-

-

Overview

Unlock the power of innovation with the SC511663MVR40R by Onsemi, a cutting-edge microcontroller that redefines performance and reliability. Onsemi's reputation for excellence shines through in this product, offering unparalleled quality and precision engineering. Ideal for a wide range of applications, this microcontroller boasts advanced features and seamless integration, delivering unmatched value and efficiency to customers. Elevate your projects to new heights with the SC511663MVR40R and experience the difference of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions, ensuring the longevity of the product.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Can handle high supply voltages, providing flexibility in power source options.

Address Bus Width: 24

Wide address bus width allows for efficient memory addressing and data retrieval.

Package Shape: SQUARE

Square shape enables uniform distribution of terminals and components, facilitating easier integration into designs.

Bit Size: 32

32-bit architecture offers fast processing speeds and large memory addressing capabilities.

No. of Terminals: 272

High number of terminals provide ample connectivity for peripherals and external components.

Package Style (Meter): GRID ARRAY

Grid array package style offers secure connections and efficient thermal management for improved performance.

Minimum Supply Voltage: 3 V

Supports low supply voltages, enabling energy-efficient operation and compatibility with various power sources.

ADC Channels: YES

Integrated ADC channels allow for analog sensor interfacing, expanding the range of applications for the microcontroller.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering, simplifying the assembly process.

Maximum Seated Height: 2.65 mm

Low seated height helps in compact designs and allows for efficient thermal dissipation.

Width: 27 mm

Compact width enables space-saving integration into various electronic devices and systems.

External Data Bus Width: 32

Wide external data bus width ensures fast data transfer and processing capabilities.

Maximum Clock Frequency: 20 MHz

High clock frequency supports fast execution of instructions and efficient multitasking.

Length: 27 mm

Compact length allows for flexibility in PCB layout and design constraints.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides streamlined instruction execution and improved performance for embedded applications.

Technology: HCMOS

HCMOS technology offers a balance between power consumption and performance, making it suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form ensures reliable connections and secure PCB mounting, enhancing the overall durability of the product.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent operation and reliable performance under varying load conditions.

PWM Channels: YES

Integrated PWM channels provide precise control over connected devices such as motors and LEDs, enhancing system functionality.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and efficient firmware updates and customization, ensuring future-proofing of the product.

Terminal Pitch: 1.27 mm

Narrow terminal pitch enables high-density PCB designs and compact layout, optimizing space utilization on the board.

Speed: 40 rpm

High operating speed of 40 rpm enables rapid data processing and real-time control in time-critical applications.

Technical Specifications

Microcontrollers SC511663MVR40R attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B272

Length:

27 mm

No. of Terminals:

272

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

HCMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SC511663MVR40R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17