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SC511653MZP40R2

NXP Semiconductors

SC511653MZP40R2 by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE; Speed: 40 rpm;

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,170 parts In-Stock

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Digiode

USA . 2,012 parts In-Stock

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Anansix

USA . 1,553 parts In-Stock

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MRC Electronics

USA . 500 parts In-Stock

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500

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Flip Electronics

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500

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Semi Source

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450

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One Stop Electronics

USA . 1,675 parts In-Stock

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SupplyDigital Components

Austria . 6,761 parts In-Stock

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Kulean Microsystems

USA . 5,936 parts In-Stock

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Corphita

USA . 3,801 parts In-Stock

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UNI Independent Distributors

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TANS Electronics

Latvia . 2,288 parts In-Stock

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Problanco Electronics

Mexico . 2,041 parts In-Stock

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UHIMA Technologies

Türkiye . 372 parts In-Stock

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Corohmni

South Africa . 357 parts In-Stock

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Technical Specifications

Microcontrollers SC511653MZP40R2 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

101

No. of Terminals:

272

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

HCMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SC511653MZP40R2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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