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SC511653MZP40R2

Onsemi

SC511653MZP40R2 by Onsemi

Onsemi SC511653MZP40R2 is a 32-bit microcontroller with 24-bit address bus, 32-bit external data bus, and 272 terminals in a grid array package. It operates at a max clock frequency of 20 MHz and has PWM channels for applications requiring precise control. Ideal for RISC-based systems needing high-speed processing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 4,170 parts In-Stock

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Digiode

USA . 2,012 parts In-Stock

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Anansix

USA . 1,553 parts In-Stock

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MRC Electronics

USA . 500 parts In-Stock

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500

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Flip Electronics

USA . 500 parts In-Stock

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500

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Semi Source

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450

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One Stop Electronics

USA . 1,675 parts In-Stock

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SupplyDigital Components

Austria . 6,761 parts In-Stock

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Kulean Microsystems

USA . 5,936 parts In-Stock

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Corphita

USA . 3,801 parts In-Stock

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UNI Independent Distributors

Spain . 3,102 parts In-Stock

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TANS Electronics

Latvia . 2,288 parts In-Stock

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Problanco Electronics

Mexico . 2,041 parts In-Stock

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UHIMA Technologies

Türkiye . 372 parts In-Stock

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Corohmni

South Africa . 357 parts In-Stock

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Overview

Unleash the power of innovation with the SC511653MZP40R2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers seeking cutting-edge technology. Elevate your projects with the SC511653MZP40R2 and experience the advantages firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for use in various electronic devices.

Surface Mount: YES

Surface mount technology makes the installation of the microcontroller easier and allows for compact design in electronic products.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power inputs, providing flexibility in different applications.

Address Bus Width: 24

A wider address bus allows for larger memory storage and better processing capabilities, making the microcontroller suitable for handling complex tasks.

Package Shape: SQUARE

The square package shape makes it easier to mount the microcontroller on a circuit board, optimizing space usage.

Bit Size: 32

A higher bit size allows for faster and more efficient processing of data, enhancing the performance of the microcontroller.

No. of Terminals: 272

Having a high number of terminals provides versatility in connecting the microcontroller to other components, enabling it to be used in a wide range of applications.

Package Style (Meter): GRID ARRAY

The grid array package style helps in reducing signal distortion and cross-talk, ensuring reliable performance of the microcontroller.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures that the microcontroller can operate efficiently even with lower power inputs, improving energy efficiency.

ADC Channels: YES

Having ADC (Analog to Digital Converter) channels allows the microcontroller to process analog signals, making it suitable for applications that require interfacing with analog sensors.

Terminal Position: BOTTOM

The terminal position at the bottom makes it convenient for soldering the microcontroller onto a circuit board, ensuring secure connections.

Maximum Seated Height: 2.65 mm

With a low seated height, the microcontroller can be used in slim electronic devices without compromising on performance.

Width: 27 mm

The moderate width of the microcontroller allows for easy integration into different electronic products, providing flexibility in design.

External Data Bus Width: 32

A wider external data bus enables the microcontroller to transfer data faster between external devices, enhancing overall system performance.

Maximum Clock Frequency: 20 MHz

A higher maximum clock frequency of 20 MHz allows the microcontroller to process instructions at a faster rate, improving its overall speed.

Length: 27 mm

The compact length of the microcontroller makes it suitable for use in small electronic devices where space is limited.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller, it offers simplified and efficient instruction sets, leading to faster execution of tasks.

Technology: HCMOS

Utilizing HCMOS technology ensures low power consumption and high reliability, making the microcontroller suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides better electrical connections and thermal stability, improving the overall performance of the microcontroller.

Nominal Supply Voltage: 3.3 V

The specified nominal supply voltage of 3.3V ensures stable operation of the microcontroller within the recommended voltage range.

PWM Channels: YES

Having PWM (Pulse Width Modulation) channels allows the microcontroller to control the speed and intensity of signals, making it ideal for motor control applications.

ROM Programmability: FLASH

The flash ROM programmability feature allows for easy reprogramming of the microcontroller, enabling quick updates and modifications to the software.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm provides high density interconnections on the microcontroller, allowing for efficient signal transmission.

Speed: 40 rpm

With a speed rating of 40 rpm, the microcontroller can process instructions quickly, making it suitable for applications that require fast response times.

Technical Specifications

Microcontrollers SC511653MZP40R2 attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B272

Length:

27 mm

No. of Terminals:

272

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

HCMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SC511653MZP40R2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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