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SC511660MVR40

Onsemi

SC511660MVR40 by Onsemi

SC511660MVR40 by Onsemi is a 32-bit microcontroller with 24-bit address bus width and 32-bit external data bus width. It operates at a max clock frequency of 20 MHz, suitable for applications requiring high-speed processing. With features like PWM channels and ADC channels, it is ideal for use in various embedded systems that demand efficient control and data acquisition capabilities.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 921 parts In-Stock

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Digiode

USA . 781 parts In-Stock

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One Stop Electronics

USA . 1,027 parts In-Stock

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$3.000

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Problanco Electronics

Mexico . 4,757 parts In-Stock

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Kulean Microsystems

USA . 3,614 parts In-Stock

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TANS Electronics

Latvia . 2,101 parts In-Stock

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Corphita

USA . 2,022 parts In-Stock

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UHIMA Technologies

Türkiye . 656 parts In-Stock

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SupplyDigital Components

Austria . 500 parts In-Stock

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Corohmni

South Africa . 375 parts In-Stock

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Overview

Unlock the power of innovation with the SC511660MVR40 by Onsemi. As a leader in microcontroller technology, Onsemi delivers quality and reliability that you can trust. Whether you're designing smart appliances, automotive systems, or industrial automation, this versatile microcontroller offers unparalleled performance and efficiency. Experience the value of seamless integration, advanced features, and cutting-edge technology, all in a compact and convenient package. Elevate your projects to new heights with the SC511660MVR40 and unleash endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space during production.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power requirements, making it suitable for a wider range of applications.

Address Bus Width: 24

A wider address bus allows for more memory address locations, enabling the microcontroller to handle larger datasets and complex operations.

Package Shape: SQUARE

The square package shape is ideal for space-saving on PCBs, maximizing utilization of board real estate in compact designs.

Bit Size: 32

A 32-bit architecture provides higher processing power and efficiency compared to lower bit sizes, making it suitable for demanding applications.

No. of Terminals: 272

With a high number of terminals, the microcontroller can support multiple connections and peripherals, enhancing functionality and versatility.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved thermal performance and robustness, ensuring reliability in challenging operating conditions.

Minimum Supply Voltage: 3 V

The lower minimum supply voltage allows for power-efficient operation, reducing energy consumption and extending battery life in portable devices.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its connectivity and input capabilities.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB routing and assembly, simplifying the manufacturing process and optimizing space utilization.

Maximum Seated Height: 2.65 mm

The low seated height profile allows for slim and compact device designs, enhancing aesthetics and portability in end-products.

Width: 27 mm

The compact width dimension enables integration into space-constrained applications, offering flexibility in design layouts and form factors.

External Data Bus Width: 32

A wide external data bus width of 32 bits enables efficient data transfer and processing, enhancing performance in data-intensive tasks.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency of 20 MHz allows for fast and responsive operation, supporting real-time processing in dynamic applications.

Length: 27 mm

The compact length dimension contributes to space-saving design integration, enabling the microcontroller to fit into small form factor devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller enhances processing speed and efficiency, suited for applications requiring high computational performance.

Technology: HCMOS

HCMOS technology offers low power consumption and high-speed operation, making the microcontroller energy-efficient and responsive in operation.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and facilitates automated soldering processes, ensuring consistent and robust assembly.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides stable power delivery to the microcontroller, ensuring consistent and reliable performance in varied conditions.

PWM Channels: YES

Pulse width modulation channels enable precise control and modulation of signals, allowing the microcontroller to adjust outputs for various applications.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating and reprogramming the microcontroller's firmware, allowing for easy customization and adaptation to changing requirements.

Terminal Pitch: 1.27 mm

The tight terminal pitch simplifies PCB layout and routing, optimizing signal integrity and reducing signal distortion for improved performance.

Speed: 40 rpm

The speed specification refers to the maximum clock frequency of the microcontroller, indicating its processing capability and performance in executing instructions.

Technical Specifications

Microcontrollers SC511660MVR40 attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B272

Length:

27 mm

No. of Terminals:

272

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

HCMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SC511660MVR40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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