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SC511658MZP40R2

Onsemi

SC511658MZP40R2 by Onsemi

SC511658MZP40R2 by Onsemi is a 32-bit microcontroller with 24-bit address bus width and 32-bit external data bus width. It operates at a max clock frequency of 20 MHz, suitable for applications requiring high-speed processing. With features like ADC channels, PWM channels, and ROM programmability, it is ideal for use in various embedded systems that demand efficient data handling and control capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 6,208 parts In-Stock

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Anansix

USA . 2,131 parts In-Stock

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Vyrian

USA . 1,013 parts In-Stock

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One Stop Electronics

USA . 2,730 parts In-Stock

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$20.000

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Component Stockers USA

USA . 719 parts In-Stock

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$99.990

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719

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TANS Electronics

Latvia . 7,734 parts In-Stock

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SupplyDigital Components

Austria . 6,577 parts In-Stock

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Problanco Electronics

Mexico . 3,987 parts In-Stock

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Corphita

USA . 3,575 parts In-Stock

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UNI Independent Distributors

Spain . 2,256 parts In-Stock

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Kulean Microsystems

USA . 549 parts In-Stock

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Corohmni

South Africa . 279 parts In-Stock

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UHIMA Technologies

Türkiye . 96 parts In-Stock

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Overview

Unleash the power of innovation with the SC511658MZP40R2 by Onsemi. As a leading manufacturer in the industry, Onsemi's microcontrollers are known for their exceptional quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering customers unmatched value and benefits. Whether you're looking to enhance your automation projects, improve efficiency in your smart home devices, or elevate the performance of your electronic gadgets, the SC511658MZP40R2 delivers cutting-edge technology that exceeds expectations. Elevate your creations with Onsemi's top-of-the-line microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability in various operating conditions.

Surface Mount: YES

Allows for easy installation on circuit boards, making it suitable for mass production and compact designs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of input voltages, offering flexibility in power supply options.

Address Bus Width: 24

Provides a large address space for memory access, enabling complex programs and data storage capabilities.

Package Shape: SQUARE

Helps optimize space utilization on PCBs and facilitates efficient placement in designs with limited space.

Bit Size: 32

Offers high computational power and capability to handle complex algorithms and processing tasks efficiently.

No. of Terminals: 272

Allows for multiple input and output connections, enhancing connectivity and functionality in electronic systems.

Package Style (Meter): GRID ARRAY

Enhances thermal dissipation and mechanical stability, ensuring reliable performance in demanding environments.

Minimum Supply Voltage: 3 V

Supports low power operation and extends battery life in portable devices or energy-efficient applications.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors and analog signals, expanding the range of applications.

Terminal Position: BOTTOM

Facilitates easy soldering and PCB assembly, improving manufacturing efficiency and reducing assembly complexity.

Maximum Seated Height: 2.65 mm

Offers a compact form factor, ideal for slim and space-constrained designs without compromising performance.

Width: 27 mm

Provides a balance between size and connectivity options, suitable for various applications with different form factor requirements.

External Data Bus Width: 32

Enhances data transfer rates and processing efficiency, enabling seamless communication with external devices and peripherals.

Maximum Clock Frequency: 20 MHz

Delivers high-speed processing capabilities, allowing for quick execution of instructions and time-critical tasks.

Length: 27 mm

Offers a compact footprint, making it suitable for applications demanding space-efficient solutions.

Peripheral IC Type: MICROCONTROLLER, RISC

Features a reduced instruction set computing architecture for efficient operation and simplified programming, enhancing performance and versatility.

Technology: HCMOS

Utilizes high-speed complementary metal-oxide-semiconductor technology for reliable and power-efficient operation, meeting the demands of modern electronics.

Terminal Form: BALL

Enables secure and reliable connections with the PCB, reducing the risk of solder joints failure and ensuring long-term stability.

Nominal Supply Voltage: 3.3 V

Provides a stable operating voltage for consistent performance, ensuring reliable operation in a variety of applications.

PWM Channels: YES

Supports pulse-width modulation for precise control of power output, suitable for motor control, lighting, and other applications requiring variable output.

ROM Programmability: FLASH

Allows for flexible and convenient programming of the read-only memory, enabling easy updates and modifications to the firmware.

Terminal Pitch: 1.27 mm

Facilitates compact PCB layout and assembly, optimizing space usage and enhancing design flexibility.

Speed: 40 rpm

Offers high processing speed for efficient execution of tasks, ensuring smooth operation and responsiveness in various applications.

Technical Specifications

Microcontrollers SC511658MZP40R2 attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B272

Length:

27 mm

No. of Terminals:

272

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

HCMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SC511658MZP40R2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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