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SC511663MVR40

Onsemi

SC511663MVR40 by Onsemi

SC511663MVR40 by Onsemi is a 32-bit microcontroller with 24-bit address bus width, operating at a max clock frequency of 20 MHz. It features 272 terminals in a grid array package style and supports PWM channels and ADC channels. Ideal for applications requiring high-speed processing and precise control, such as industrial automation systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,016 parts In-Stock

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Digiode

USA . 1,593 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,436 parts In-Stock

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$10.000

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TANS Electronics

Latvia . 7,099 parts In-Stock

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SupplyDigital Components

Austria . 5,937 parts In-Stock

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Kulean Microsystems

USA . 5,777 parts In-Stock

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Problanco Electronics

Mexico . 1,731 parts In-Stock

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Corphita

USA . 1,246 parts In-Stock

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Corohmni

South Africa . 480 parts In-Stock

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UHIMA Technologies

Türkiye . 310 parts In-Stock

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Overview

Unlock the power of innovation with the SC511663MVR40 by Onsemi. As a leading manufacturer in the field of microcontrollers, Onsemi delivers top-quality products that meet the highest industry standards. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers looking for reliable and efficient solutions. Experience the advantages of the SC511663MVR40 and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, the microcontroller can operate efficiently within this range without risk of damage.

Address Bus Width: 24

A wider address bus width allows for increased memory addressing capabilities, enabling more complex program execution.

Package Shape: SQUARE

The square package shape helps in efficient PCB layout design and space utilization.

Bit Size: 32

A 32-bit microcontroller offers higher processing power and data handling capacity compared to lower bit sizes.

No. of Terminals: 272

Having a high number of terminals allows for more connectivity options and interfacing with external components.

Package Style (Meter): GRID ARRAY

Grid array package style provides better mechanical strength and thermal performance in harsh operating environments.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures reliable operation even at lower power input levels.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, making the microcontroller suitable for sensor interface applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and PCB mounting, enhancing overall assembly efficiency.

Maximum Seated Height: 2.65 mm

Low maximum seated height allows for compact and slim device designs, especially useful in space-constrained applications.

Width: 27 mm

A moderate width of 27mm ensures compatibility with various PCB layouts while providing enough space for routing signals.

External Data Bus Width: 32

A wider external data bus width of 32 bits supports faster data transfer rates and enhances overall system performance.

Maximum Clock Frequency: 20 MHz

A maximum clock frequency of 20 MHz allows for high-speed operations and real-time processing of data.

Length: 27 mm

A length of 27mm ensures a compact form factor, suitable for applications where space is limited.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller offers high efficiency, fast execution times, and low power consumption.

Technology: HCMOS

HCMOS technology provides high speed and low power consumption, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form offers better electrical performance, mechanical stability, and soldering reliability compared to other forms.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures stability and compatibility with common power sources.

PWM Channels: YES

Presence of PWM channels allows for precise control of output signals, making the microcontroller suitable for motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability enables flexible firmware updates and customization, enhancing the microcontroller's versatility and adaptability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27mm offers good solder joint reliability and easy PCB layout integration, aiding in assembly and maintenance.

Speed: 40 rpm

With a speed of 40 rpm, the microcontroller can efficiently process instructions and data, meeting the performance requirements of various applications.

Technical Specifications

Microcontrollers SC511663MVR40 attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B272

Length:

27 mm

No. of Terminals:

272

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

HCMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SC511663MVR40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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