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NXV08V080DB1

Onsemi

NXV08V080DB1 by Onsemi

NXV08V080DB1 by Onsemi is an AEC-Q100 compliant Motion Control IC with 19 terminals in a rectangular package. Operating temperature ranges from -40 °C to 125°C, suitable for automotive applications. It is an AC motor controller with flange mount style and dual terminal position.

Median Price

$21.364

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 32 parts In-Stock

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$30.130

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$27.320

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Rochester

USA . 6,799 parts In-Stock

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$18.990

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$16.990

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$15.990

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$18.990

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$15.990

Verical

USA . 6,799 parts In-Stock

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$23.738

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$21.238

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$19.988

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$23.738

$21.238

$19.988

DigiKey

USA . 88 parts In-Stock

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$17.570

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Flip Electronics (Authorized)

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Digiode

USA . 2,294 parts In-Stock

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$20.045

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Vyrian

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Flip Electronics

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Vigor

Singapore . 513 parts In-Stock

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$18.520

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Corphita

USA . 134 parts In-Stock

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$18.990

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Corohmni

South Africa . 174 parts In-Stock

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$21.100

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Component Stockers USA

USA . 132 parts In-Stock

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$21.670

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Problanco Electronics

Mexico . 5,484 parts In-Stock

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Kulean Microsystems

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

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TANS Electronics

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UHIMA Technologies

Türkiye . 152 parts In-Stock

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Perfect Parts

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Overview

Enhance your automotive motion control systems with the NXV08V080DB1 by Onsemi. Manufactured with the highest quality standards, this AEC-Q100 screened IC offers unparalleled reliability and performance. Ideal for AC motor controllers, this rectangular package style IC provides precise control and efficiency in a wide range of automotive applications. Trust Onsemi's expertise and experience to deliver the value and benefits you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Screening Level: AEC-Q100

This product has undergone rigorous testing to meet automotive industry standards, ensuring high reliability and quality.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on a PCB, making it suitable for compact designs.

No. of Terminals: 19

With 19 terminals, this product offers flexibility in connectivity options for various applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance even in harsh automotive environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the product can operate in extreme cold conditions as well.

Width (mm): 37.34 mm

Compact width facilitates easy integration into tight spaces, ideal for automotive applications with limited space.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for controlling AC motors, providing precise and efficient motor control capabilities.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry temperature requirements, ensuring reliable performance in automotive applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connections, suitable for automotive applications that may experience mechanical stress.

Technical Specifications

Motion Control ICs NXV08V080DB1 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDFM-T19

Length:

44 mm

No. of Functions:

1

No. of Terminals:

19

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANG MOUNT

Screening Level:

AEC-Q100

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

37.34 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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