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NXV08V110DB1

Onsemi

NXV08V110DB1 by Onsemi

The Onsemi NXV08V110DB1 is an AEC-Q100 compliant Motion Control IC with 19 terminals in a rectangular package. It operates b/w -40°C to 125°C, making it suitable for automotive applications. This AC Motor Controller has a width of 37.34mm and length of 44mm, ideal for flange mount installations.

Median Price

$27.629

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$28.270

100+ parts

$25.790

1k+ parts

$24.670

10k+ parts

-

6

$28.270

$25.790

$24.670

-

DigiKey

USA . 85 parts In-Stock

1+ parts

$34.800

100+ parts

$25.810

1k+ parts

$23.932

10k+ parts

-

85

$34.800

$25.810

$23.932

-

Chip1Stop

Japan . 530 parts In-Stock

1+ parts

$119.000

100+ parts

$56.200

1k+ parts

$40.600

10k+ parts

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530

$119.000

$56.200

$40.600

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Verical

USA . 792 parts In-Stock

1+ parts

-

100+ parts

$26.988

1k+ parts

$24.150

10k+ parts

$22.725

792

-

$26.988

$24.150

$22.725

Rochester

USA . 792 parts In-Stock

1+ parts

-

100+ parts

$21.590

1k+ parts

$19.320

10k+ parts

$18.180

792

-

$21.590

$19.320

$18.180

Farnell

UK . 44 parts In-Stock

1+ parts

-

100+ parts

$17.570

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-

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44

-

$17.570

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Distributors (In-Stock)

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Digiode

USA . 1,125 parts In-Stock

1+ parts

$31.968

100+ parts

-

1k+ parts

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1,125

$31.968

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Vyrian

USA . 6,404 parts In-Stock

1+ parts

-

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6,404

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Flip Electronics

USA . 220 parts In-Stock

1+ parts

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220

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 545 parts In-Stock

1+ parts

$19.040

100+ parts

-

1k+ parts

-

10k+ parts

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545

$19.040

-

-

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Modulus Dynamics

Lithuania . 5,526 parts In-Stock

1+ parts

$21.873

100+ parts

$21.873

1k+ parts

$21.873

10k+ parts

-

5,526

$21.873

$21.873

$21.873

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Vigor

Singapore . 967 parts In-Stock

1+ parts

$24.220

100+ parts

-

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967

$24.220

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Ampacity Inc.

Singapore . 203 parts In-Stock

1+ parts

$28.600

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203

$28.600

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Corphita

USA . 1,866 parts In-Stock

1+ parts

$30.285

100+ parts

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1,866

$30.285

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Corohmni

South Africa . 371 parts In-Stock

1+ parts

$33.650

100+ parts

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371

$33.650

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QUARKTWIN TECHNOLOGY LTD

USA . 8,469 parts In-Stock

1+ parts

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8,469

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TANS Electronics

Latvia . 7,471 parts In-Stock

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7,471

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Microchip USA

USA . 5,208 parts In-Stock

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5,208

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Argo Parts USA

USA . 4,296 parts In-Stock

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4,296

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SupplyDigital Components

Austria . 3,318 parts In-Stock

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3,318

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Kulean Microsystems

USA . 3,158 parts In-Stock

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3,158

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Continental Prestige Electronics

USA . 1,499 parts In-Stock

1+ parts

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100+ parts

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1,499

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UHIMA Technologies

Türkiye . 686 parts In-Stock

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686

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GreenTree Electronics

Israel . 684 parts In-Stock

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684

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Problanco Electronics

Mexico . 628 parts In-Stock

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628

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Aranea Global

USA . 100 parts In-Stock

1+ parts

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100+ parts

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100

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Overview

Discover the cutting-edge NXV08V110DB1 by Onsemi, a top-tier Motion Control IC designed for automotive applications. With a stringent AEC-Q100 screening level and a temperature grade of AUTOMOTIVE, this innovative product guarantees reliability and durability in extreme conditions. Boasting 19 terminals and a sleek rectangular package shape, it offers seamless integration and exceptional performance. Whether you're looking to enhance AC motor control or optimize motion control systems, this AC MOTOR CONTROLLER is the ultimate solution. Elevate your projects with the unmatched quality and value of the NXV08V110DB1 from Onsemi.

Feature Benefit Bullets

Screening Level: AEC-Q100

This product has undergone thorough automotive testing to ensure high reliability and quality.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and compact design in automotive systems.

No. of Terminals: 19

Sufficient number of terminals for connecting various components and devices in the system.

Package Style (Meter): FLANG MOUNT

Flange mount package style provides secure mounting and easy installation in automotive applications.

Maximum Operating Temperature: 125 °C

Withstands high temperatures typical in automotive environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and easy connection to other components.

Width (mm): 37.34 mm

Compact width ensures space-saving design in automotive systems with limited space.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for controlling AC motors, making it a reliable choice for motion control applications.

Length: 44 mm

Optimal length for accommodating necessary components and connections while maintaining a compact form factor.

Temperature Grade: AUTOMOTIVE

Designed and tested for automotive-grade temperature ranges, ensuring reliable operation in vehicle applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering for reliable performance in automotive systems.

Technical Specifications

Motion Control ICs NXV08V110DB1 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDFM-T19

Length:

44 mm

No. of Functions:

1

No. of Terminals:

19

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANG MOUNT

Screening Level:

AEC-Q100

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

37.34 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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