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NVMD6N03R2G

Onsemi

NVMD6N03R2G by Onsemi

NVMD6N03R2G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 6A ID, and 0.032 ohm RDS(ON). It's used for SWITCHING applications in automotive (AEC-Q101) due to its 30A IDM and 325mJ EAS ratings.

Median Price

$0.401

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,915 parts In-Stock

1+ parts

-

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$0.357

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$0.296

10k+ parts

$0.264

4,915

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$0.357

$0.296

$0.264

DigiKey

USA . 4,915 parts In-Stock

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$0.450

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$0.450

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Verical

USA . 4,915 parts In-Stock

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$0.401

10k+ parts

$0.330

4,915

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-

$0.401

$0.330

Distributors (In-Stock)

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Digiode

USA . 539 parts In-Stock

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$0.277

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539

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Chip Stock

USA . 54,000 parts In-Stock

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Vyrian

USA . 10,192 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,650 parts In-Stock

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$0.263

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$0.263

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Corohmni

South Africa . 370 parts In-Stock

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$0.292

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370

$0.292

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AZTECH Wire

Italy . 1,185 parts In-Stock

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$17.720

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$17.720

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Continental Prestige Electronics

USA . 4,915 parts In-Stock

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$0.285

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$0.285

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TANS Electronics

Latvia . 4,211 parts In-Stock

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Kulean Microsystems

USA . 3,453 parts In-Stock

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Perfect Parts

USA . 2,705 parts In-Stock

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SupplyDigital Components

Austria . 1,826 parts In-Stock

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Problanco Electronics

Mexico . 567 parts In-Stock

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Kepictronics

USA . 234 parts In-Stock

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UHIMA Technologies

Türkiye . 178 parts In-Stock

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Overview

Unlock the power of efficiency with the NVMD6N03R2G by Onsemi. As a leader in power field effect transistors, Onsemi delivers unmatched quality and reliability in every product. Ideal for switching applications, this N-channel transistor offers seamless performance with a maximum drain current of 6A and low on-resistance. With its compact design and built-in diode, this transistor is perfect for a wide range of electronic devices. Trust Onsemi to provide cutting-edge technology that maximizes value and performance for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistors, ensuring long-term reliability.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having separate elements with a built-in diode allows for versatile circuit designs and efficient performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high performance and efficiency in controlling power flow.

Surface Mount: YES

Being surface mountable, this FET is easy to install and saves space on the PCB.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can handle higher voltages and provides better protection against voltage spikes.

Avalanche Energy Rating (EAS): 325 mJ

This high energy rating makes the FET suitable for applications where there may be high-energy spikes, ensuring device protection.

Maximum Drain-Source On Resistance: 0.032 ohm

Low on-resistance results in minimal power loss and improved efficiency during operation.

Technical Specifications

Power Field Effect Transistors (FET) NVMD6N03R2G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA LOW ON RESISTANCE

Avalanche Energy Rating (EAS):

325 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

30 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVMD6N03R2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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